Marco Koitz

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,636,754
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for forming a chip pad
- Patent number 10,236,265
- Issue date Mar 19, 2019
- Infineon Technologies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a contact pad
- Patent number 8,603,910
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Marco Koitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip and Method for Forming a Chip Pad
- Publication number 20190189574
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Forming a Chip Pad
- Publication number 20160027746
- Publication date Jan 28, 2016
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A CONTACT PAD
- Publication number 20130180945
- Publication date Jul 18, 2013
- INFINEON TECHNOLOGIES AG
- Marco Koitz
- H01 - BASIC ELECTRIC ELEMENTS