Marco Mueller

Person

Pirna, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a high breakdown voltage
- Patent number 11,682,696
- Issue date Jun 20, 2023
- Infineon Technologies Dresden GmbH & Co. KG
- Ahmed Mahmoud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a high breakdown voltage
- Patent number 11,682,695
- Issue date Jun 20, 2023
- Infineon Technologies Dresden GmbH & Co. KG
- Ahmed Mahmoud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 9,527,725
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer, a method for processing a wafer, and a method for processing...
- Patent number 9,236,241
- Issue date Jan 12, 2016
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,921,954
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 8,723,276
- Issue date May 13, 2014
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,518,732
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FILL PATTERN FOR POWER TRANSISTOR AND DIODE DEVICES
- Publication number 20220093792
- Publication date Mar 24, 2022
- Rolf Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20210376066
- Publication date Dec 2, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Ahmed Mahmoud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20210376065
- Publication date Dec 2, 2021
- Ahmed Mahmoud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, A METHOD FOR PROCESSING A WAFER, AND A METHOD FOR PROCESSING...
- Publication number 20150318166
- Publication date Nov 5, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Thoralf KAUTZSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH
- Publication number 20140227818
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...
- Publication number 20130334624
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Providing a Semiconductor Structure with Forming A Sacrif...
- Publication number 20120161254
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Structure with Lamella Defined by Singulation Trench
- Publication number 20110068420
- Publication date Mar 24, 2011
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Marco Mueller

Person

Patents Grantslast 30 patents

Semiconductor device having a high breakdown voltage

Semiconductor device having a high breakdown voltage

Semiconductor structure with lamella defined by singulation trench

Wafer, a method for processing a wafer, and a method for processing...

Method of providing a semiconductor structure with forming a sacrif...

Semiconductor structure with lamella defined by singulation trench

Method of providing a semiconductor structure with forming a sacrif...

Patents Applicationslast 30 patents

FILL PATTERN FOR POWER TRANSISTOR AND DIODE DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME

WAFER, A METHOD FOR PROCESSING A WAFER, AND A METHOD FOR PROCESSING...

SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH

METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...

Method of Providing a Semiconductor Structure with Forming A Sacrif...

Semiconductor Structure with Lamella Defined by Singulation Trench