Marcus Bernard Hsu

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer connection
- Patent number 11,784,151
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having a substrate comprising surface interconnects aligned...
- Patent number 11,682,607
- Issue date Jun 20, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component embedded in an embedded trace substrate (ETS)
- Patent number 11,552,023
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 11,527,498
- Issue date Dec 13, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing split, double-sided meta...
- Patent number 11,456,291
- Issue date Sep 27, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate configured as a heat spreader
- Patent number 11,404,343
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density embedded interconnects in substrate
- Patent number 10,804,195
- Issue date Oct 13, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with reduced height
- Patent number 9,484,327
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A BRIDGE
- Publication number 20220375838
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING A SUBSTRATE COMPRISING SURFACE INTERCONNECTS ALIGNED...
- Publication number 20220246496
- Publication date Aug 4, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP PAD STRUCTURE
- Publication number 20220102298
- Publication date Mar 31, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER CONNECTION
- Publication number 20220028816
- Publication date Jan 27, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...
- Publication number 20210407979
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)
- Publication number 20210407918
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...
- Publication number 20210280523
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER
- Publication number 20210249325
- Publication date Aug 12, 2021
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY EMBEDDED INTERCONNECTS IN SUBSTRATE
- Publication number 20200051907
- Publication date Feb 13, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYMMETRIC EMBEDDED TRACE SUBSTRATE
- Publication number 20180350630
- Publication date Dec 6, 2018
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT
- Publication number 20140264946
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Marcus Bernard Hsu

Person

Patents Grantslast 30 patents

Redistribution layer connection

Package having a substrate comprising surface interconnects aligned...

Passive component embedded in an embedded trace substrate (ETS)

Bump pad structure

Integrated circuit (IC) packages employing split, double-sided meta...

Package comprising a substrate configured as a heat spreader

High density embedded interconnects in substrate

Package-on-package structure with reduced height

Patents Applicationslast 30 patents

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A BRIDGE

PACKAGE HAVING A SUBSTRATE COMPRISING SURFACE INTERCONNECTS ALIGNED...

BUMP PAD STRUCTURE

REDISTRIBUTION LAYER CONNECTION

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...

PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...

PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER

HIGH DENSITY EMBEDDED INTERCONNECTS IN SUBSTRATE

SYMMETRIC EMBEDDED TRACE SUBSTRATE

PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT