Marcus Böhm

Person

Mintraching, DE

People

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Single Integral Body Carrying Two Transistor Chips wit...
- Publication number 20240395676
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Marcus Böhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240162205
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Marcus BÖHM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...
- Publication number 20230361009
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20230178462
- Publication date Jun 8, 2023
- Infineon Technologies Austria AG
- Stefan Wötzel
- H01 - BASIC ELECTRIC ELEMENTS

Marcus Böhm

Person

Patents Applicationslast 30 patents

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

Package with Single Integral Body Carrying Two Transistor Chips wit...

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNE...

PACKAGE FOR A LATERAL POWER TRANSISTOR