Marcus Boehm

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Thalmassing, DE

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED INLAY
- Publication number 20230369177
- Publication date Nov 16, 2023
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZATION OF STOKES' LOSSES DUE TO PHOTON MULTIPLICATION PROCESS...
- Publication number 20230160557
- Publication date May 25, 2023
- Osram Opto Semiconductors GmbH
- Ion STOLL
- B82 - NANO-TECHNOLOGY
Information Patent Application
µLED Chip Architecture Based on Nanostructured Perovskite Converter...
- Publication number 20210261860
- Publication date Aug 26, 2021
- OSRAM OLED GmbH
- Marcus Boehm
- B82 - NANO-TECHNOLOGY
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20210225744
- Publication date Jul 22, 2021
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS