Marcus Franciscus Donker

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Wijchen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device package
- Patent number 10,475,973
- Issue date Nov 12, 2019
- Lumileds LLC
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,691,959
- Issue date Jun 27, 2017
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, method of manufacturing a package and frame
- Patent number 8,217,281
- Issue date Jul 10, 2012
- NXP B.V.
- Leonardus A. E. Van Gemert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Saw singulation
- Patent number 7,281,535
- Issue date Oct 16, 2007
- Towa Intercon Technology, Inc.
- Chris Mihai
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20170288109
- Publication date Oct 5, 2017
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20160315237
- Publication date Oct 27, 2016
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, METHOD OF MANUFACTURING A PACKAGE AND FRAME
- Publication number 20100051345
- Publication date Mar 4, 2010
- NXP, B.V.
- Leonardus A. E. Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Saw singulation
- Publication number 20050268899
- Publication date Dec 8, 2005
- TOWA Intercon Technology, Inc.
- Chris Mihia
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...