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Marcus Yang
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Hsinchu City, TW
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Patents Grants
last 30 patents
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Patent Grant
Method for forming fuse pad and bond pad of integrated circuit
Patent number
9,496,221
Issue date
Nov 15, 2016
Taiwan Semiconductor Manufacturing Co., Ltd.
Tai-I Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Masking-Less Fuse Formation with Oxide Remaining
Publication number
20130341757
Publication date
Dec 26, 2013
Taiwan Semiconductor Manufacturing Co., LTD
Tai-I Yang
H01 - BASIC ELECTRIC ELEMENTS