Margaret A. Szymanowski

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated multiple-path power amplifier
- Patent number 11,522,499
- Issue date Dec 6, 2022
- NXP USA, INC.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Digital step attenuator and method for operating a digital step att...
- Patent number 11,277,119
- Issue date Mar 15, 2022
- NXP USA, INC.
- Namsik Ryu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrally-formed multiple-path power amplifier with on-die combini...
- Patent number 11,277,098
- Issue date Mar 15, 2022
- NXP USA, INC.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier integrated circuit with integrated shunt-l circuit...
- Patent number 11,223,336
- Issue date Jan 11, 2022
- NXP USA, INC.
- Xin Fu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier with integrated bias circuit having multi-point input
- Patent number 11,190,145
- Issue date Nov 30, 2021
- NXP USA, INC.
- Xavier Hue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-stage power amplifiers and amplifier arrays configured to...
- Patent number 11,159,134
- Issue date Oct 26, 2021
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 11,108,362
- Issue date Aug 31, 2021
- NXP USA, INC.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multiple-path power amplifier
- Patent number 11,018,629
- Issue date May 25, 2021
- NXP USA, INC.
- Seungkee Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,630,243
- Issue date Apr 21, 2020
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device with harmonic termination circuit
- Patent number 10,587,226
- Issue date Mar 10, 2020
- NXP USA, INC.
- Maruf Ahmed
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 10,566,935
- Issue date Feb 18, 2020
- NXP USA, INC.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,476,442
- Issue date Nov 12, 2019
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wire bond wall to reduce coupling
- Patent number 10,269,729
- Issue date Apr 23, 2019
- NXP USA, INC.
- Shun Meen Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Amplifier architecture reconfiguration
- Patent number 10,211,784
- Issue date Feb 19, 2019
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,110,170
- Issue date Oct 23, 2018
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-stage RF amplifier devices
- Patent number 10,069,462
- Issue date Sep 4, 2018
- NXP USA, INC.
- Seungkee Min
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor packages having wire bond wall to reduce coupling
- Patent number 9,978,691
- Issue date May 22, 2018
- NXP USA, INC.
- Shun Meen Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple-path RF amplifiers with angularly offset signal path direc...
- Patent number 9,774,301
- Issue date Sep 26, 2017
- NXP USA, INC.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and system with an isolation structure to red...
- Patent number 9,673,164
- Issue date Jun 6, 2017
- NXP USA, INC.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable power splitters and amplifiers, and corresponding me...
- Patent number 9,647,611
- Issue date May 9, 2017
- NXP USA, INC.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaged RF amplifier devices with grounded isolation structures an...
- Patent number 9,589,927
- Issue date Mar 7, 2017
- NXP USA, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 9,450,547
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having wire bond wall to reduce coupling
- Patent number 9,401,342
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Shun Meen Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaged RF amplifier devices and methods of manufacture thereof
- Patent number 9,337,774
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Monolithic transistor circuits with tapered feedback resistors, RF...
- Patent number 9,331,642
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sarmad K. Musa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor packages having wire bond wall to reduce coupling
- Patent number 9,240,390
- Issue date Jan 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Shun Meen Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Self-defining, low capacitance wire bond pad
- Patent number 8,890,339
- Issue date Nov 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic elements and devices with trench under bond pad feature
- Patent number 8,134,241
- Issue date Mar 13, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming an RF device with trench under bond pad feature
- Patent number 7,998,852
- Issue date Aug 16, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIGITAL STEP ATTENUATOR AND METHOD FOR OPERATING A DIGITAL STEP ATT...
- Publication number 20210320646
- Publication date Oct 14, 2021
- NXP USA, Inc.
- Namsik RYU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-STAGE POWER AMPLIFIERS AND AMPLIFIER ARRAYS CONFIGURED TO...
- Publication number 20210194440
- Publication date Jun 24, 2021
- NXP USA, Inc.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED MULTIPLE-PATH POWER AMPLIFIER
- Publication number 20210175854
- Publication date Jun 10, 2021
- NXP USA, Inc.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MULTIPLE-PATH POWER AMPLIFIER
- Publication number 20200403576
- Publication date Dec 24, 2020
- NXP USA, Inc.
- Seungkee Min
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...
- Publication number 20200186097
- Publication date Jun 11, 2020
- NXP USA, Inc.
- Xavier Hue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER INTEGRATED CIRCUIT WITH INTEGRATED SHUNT-L CIRCUIT...
- Publication number 20200186107
- Publication date Jun 11, 2020
- NXP USA, Inc.
- Xin Fu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER WITH INTEGRATED BIAS CIRCUIT HAVING MULTI-POINT INPUT
- Publication number 20200186096
- Publication date Jun 11, 2020
- NXP USA, Inc.
- Xavier Hue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...
- Publication number 20200144968
- Publication date May 7, 2020
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION
- Publication number 20200098684
- Publication date Mar 26, 2020
- NXP USA, Inc.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20200067460
- Publication date Feb 27, 2020
- NXP USA, Inc.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
AMPLIFIER DEVICE WITH HARMONIC TERMINATION CIRCUIT
- Publication number 20190296693
- Publication date Sep 26, 2019
- NXP USA, Inc.
- Maruf AHMED
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20190028063
- Publication date Jan 24, 2019
- NXP USA, Inc.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING
- Publication number 20180269158
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Shun Meen Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTIPLE-STAGE RF AMPLIFIER DEVICES
- Publication number 20180248521
- Publication date Aug 30, 2018
- NXP USA, Inc.
- Seungkee Min
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Amplifier Architecture Reconfiguration
- Publication number 20180123520
- Publication date May 3, 2018
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...
- Publication number 20180013391
- Publication date Jan 11, 2018
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE POWER SPLITTERS AND AMPLIFIERS, AND CORRESPONDING ME...
- Publication number 20170126181
- Publication date May 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Ramanujam Srinidhi EMBAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20170005621
- Publication date Jan 5, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING
- Publication number 20160211222
- Publication date Jul 21, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHUN MEEN KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20160087586
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MARGARET A. SZYMANOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED RF AMPLIFIER DEVICES WITH GROUNDED ISOLATION STRUCTURES AN...
- Publication number 20160087588
- Publication date Mar 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- MARGARET A. SZYMANOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC TRANSISTOR CIRCUITS WITH TAPERED FEEDBACK RESISTORS, RF...
- Publication number 20150381122
- Publication date Dec 31, 2015
- SARMAD K. MUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SYSTEM WITH AN ISOLATION STRUCTURE TO RE...
- Publication number 20150311131
- Publication date Oct 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20150170986
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WIRE BOND WALL TO REDUCE COUPLING
- Publication number 20150002226
- Publication date Jan 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Shun Meen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING
- Publication number 20150002229
- Publication date Jan 1, 2015
- FREESCALE SEMICONDUCTOR, INC.
- SHUN MEEN KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD
- Publication number 20140319703
- Publication date Oct 30, 2014
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE
- Publication number 20110266687
- Publication date Nov 3, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICE AND METHOD WITH TRENCH UNDER BOND PAD FEATURE
- Publication number 20100140814
- Publication date Jun 10, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Margaret A. Szymanowski

Person

Patents Grantslast 30 patents

Integrated multiple-path power amplifier

Digital step attenuator and method for operating a digital step att...

Integrally-formed multiple-path power amplifier with on-die combini...

Power amplifier integrated circuit with integrated shunt-l circuit...

Power amplifier with integrated bias circuit having multi-point input

Multiple-stage power amplifiers and amplifier arrays configured to...

Multiple-path RF amplifiers with angularly offset signal path direc...

Integrated multiple-path power amplifier

Semiconductor package having an isolation wall to reduce electromag...

Amplifier device with harmonic termination circuit

Multiple-path RF amplifiers with angularly offset signal path direc...

Semiconductor package having an isolation wall to reduce electromag...

Semiconductor packages having wire bond wall to reduce coupling

Amplifier architecture reconfiguration

Semiconductor package having an isolation wall to reduce electromag...

Multiple-stage RF amplifier devices

Semiconductor packages having wire bond wall to reduce coupling

Multiple-path RF amplifiers with angularly offset signal path direc...

Semiconductor package and system with an isolation structure to red...

Reconfigurable power splitters and amplifiers, and corresponding me...

Packaged RF amplifier devices with grounded isolation structures an...

Semiconductor package having an isolation wall to reduce electromag...

Semiconductor package having wire bond wall to reduce coupling

Packaged RF amplifier devices and methods of manufacture thereof

Monolithic transistor circuits with tapered feedback resistors, RF...

Semiconductor packages having wire bond wall to reduce coupling

Self-defining, low capacitance wire bond pad

Electronic elements and devices with trench under bond pad feature

Methods for forming an RF device with trench under bond pad feature

Patents Applicationslast 30 patents

DIGITAL STEP ATTENUATOR AND METHOD FOR OPERATING A DIGITAL STEP ATT...

MULTIPLE-STAGE POWER AMPLIFIERS AND AMPLIFIER ARRAYS CONFIGURED TO...

INTEGRATED MULTIPLE-PATH POWER AMPLIFIER

INTEGRATED MULTIPLE-PATH POWER AMPLIFIER

INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...

POWER AMPLIFIER INTEGRATED CIRCUIT WITH INTEGRATED SHUNT-L CIRCUIT...

POWER AMPLIFIER WITH INTEGRATED BIAS CIRCUIT HAVING MULTI-POINT INPUT

MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...

TRANSISTOR, PACKAGED DEVICE, AND METHOD OF FABRICATION

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

AMPLIFIER DEVICE WITH HARMONIC TERMINATION CIRCUIT

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING

MULTIPLE-STAGE RF AMPLIFIER DEVICES

Amplifier Architecture Reconfiguration

MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIREC...

RECONFIGURABLE POWER SPLITTERS AND AMPLIFIERS, AND CORRESPONDING ME...

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING

PACKAGED RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURE THEREOF

PACKAGED RF AMPLIFIER DEVICES WITH GROUNDED ISOLATION STRUCTURES AN...

MONOLITHIC TRANSISTOR CIRCUITS WITH TAPERED FEEDBACK RESISTORS, RF...

SEMICONDUCTOR PACKAGE AND SYSTEM WITH AN ISOLATION STRUCTURE TO RE...

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SEMICONDUCTOR PACKAGE HAVING WIRE BOND WALL TO REDUCE COUPLING

SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING

SELF-DEFINING, LOW CAPACITANCE WIRE BOND PAD

ELECTRONIC ELEMENTS AND DEVICES WITH TRENCH UNDER BOND PAD FEATURE

RF DEVICE AND METHOD WITH TRENCH UNDER BOND PAD FEATURE