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Margherita Chang
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Portland, OR, US
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Patents Grants
last 30 patents
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Patent Grant
Method for constructing contact formations
Patent number
7,442,634
Issue date
Oct 28, 2008
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Under bump metallization layer to enable use of high tin content so...
Patent number
7,064,446
Issue date
Jun 20, 2006
Intel Corporation
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Method for constructing contact formations
Publication number
20060134902
Publication date
Jun 22, 2006
Valery M. Dubin
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Under bump metallization layer to enable use of high tin content so...
Publication number
20050250323
Publication date
Nov 10, 2005
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER BUMP METALLIZATION LAYER TO ENABLE USE OF HIGH TIN CONTENT SO...
Publication number
20050212133
Publication date
Sep 29, 2005
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS