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Mari J. Rossman
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Corvallis, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package for a micro-electro mechanical device
Patent number
9,006,877
Issue date
Apr 14, 2015
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System and method for hermetically sealing a package
Patent number
7,550,859
Issue date
Jun 23, 2009
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Package for a micro-electro mechanical device
Patent number
7,465,600
Issue date
Dec 16, 2008
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System and method for hermetically sealing a package
Patent number
7,276,398
Issue date
Oct 2, 2007
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE FOR A MICRO-ELECTRO MECHANICAL DEVICE
Publication number
20090057790
Publication date
Mar 5, 2009
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
System and Method for Hermetically Sealing a Package
Publication number
20070290309
Publication date
Dec 20, 2007
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Package for a micro-electro mechanical device
Publication number
20050173769
Publication date
Aug 11, 2005
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
System and method for hermetically sealing a package
Publication number
20050089283
Publication date
Apr 28, 2005
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY