Maria Cristina B. Estacio

Person

CebuCity, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with clip interconnect and dual side c...
- Patent number 12,051,635
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concealed gate terminal semiconductor packages and related methods
- Patent number 11,791,247
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta Almagro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC MOSFET semiconductor packages and related methods
- Patent number 11,621,203
- Issue date Apr 4, 2023
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,545,421
- Issue date Jan 3, 2023
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 11,502,027
- Issue date Nov 15, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leaderframe
- Patent number 11,296,069
- Issue date Apr 5, 2022
- Semiconductor Components Industries, LLC
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 11,177,203
- Issue date Nov 16, 2021
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with clip interconnect and dual side c...
- Patent number 11,088,046
- Issue date Aug 10, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 10,943,855
- Issue date Mar 9, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 10,910,297
- Issue date Feb 2, 2021
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interposer on a leadframe
- Patent number 10,546,847
- Issue date Jan 28, 2020
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Elsie Agdon Cabahug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 10,319,670
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and horizontal circuit assemblies
- Patent number 10,256,178
- Issue date Apr 9, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor device packages
- Patent number 9,685,398
- Issue date Jun 20, 2017
- Fairchild Semiconductor Corporation
- Margie Rios
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including low stress configuration
- Patent number 9,583,454
- Issue date Feb 28, 2017
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of manufacturing
- Patent number 9,536,800
- Issue date Jan 3, 2017
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including a semiconductor die and a capacitive component
- Patent number 9,478,519
- Issue date Oct 25, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus related to an improved package including a semiconductor die
- Patent number 9,177,925
- Issue date Nov 3, 2015
- Fairfchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pre-molded clip structure
- Patent number 8,513,059
- Issue date Aug 20, 2013
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,183,088
- Issue date May 22, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package including low stress configuration
- Patent number 8,106,501
- Issue date Jan 31, 2012
- Fairchild Semiconductor Corporation
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 8,008,759
- Issue date Aug 30, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including exposed connections
- Patent number 7,972,906
- Issue date Jul 5, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 7,838,340
- Issue date Nov 23, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 7,768,105
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20240363471
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230402350
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230207411
- Publication date Jun 29, 2023
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220102248
- Publication date Mar 31, 2022
- Semiconductor Components Industries, LLC
- Erwin Ian Vamenta ALMAGRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20220059443
- Publication date Feb 24, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20210351099
- Publication date Nov 11, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20210193561
- Publication date Jun 24, 2021
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20210151367
- Publication date May 20, 2021
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20200219866
- Publication date Jul 9, 2020
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20200098870
- Publication date Mar 26, 2020
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...
- Publication number 20190393119
- Publication date Dec 26, 2019
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20190287886
- Publication date Sep 19, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20190181083
- Publication date Jun 13, 2019
- Fairchild Semiconductor Corporation
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20190122970
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20190067171
- Publication date Feb 28, 2019
- Semiconductor Components Industries, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES
- Publication number 20180068935
- Publication date Mar 8, 2018
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20160284628
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Margie RIOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTERPOSER ON A LEADFRAME
- Publication number 20160284631
- Publication date Sep 29, 2016
- Fairchild Semiconductor Corporation
- Elsie Agdon CABAHUG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
- Publication number 20160126219
- Publication date May 5, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20150162270
- Publication date Jun 11, 2015
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...
- Publication number 20140312458
- Publication date Oct 23, 2014
- Fairchild Semiconductor Corporation
- Ahmad ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION
- Publication number 20120083071
- Publication date Apr 5, 2012
- Maria Clemens Y. Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20110272794
- Publication date Nov 10, 2011
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258924
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258923
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Maria Cristina B. Estacio

Person

Patents Grantslast 30 patents

Submodule semiconductor package

Package including multiple semiconductor devices

Semiconductor device package with clip interconnect and dual side c...

Semiconductor packages using package in package systems and related...

Concealed gate terminal semiconductor packages and related methods

SiC MOSFET semiconductor packages and related methods

Package including multiple semiconductor devices

Package including multiple semiconductor devices

Substrate interposer on a leaderframe

Vertical and horizontal circuit assemblies

Semiconductor device package with clip interconnect and dual side c...

Electronic device packaging with galvanic isolation

Package including multiple semiconductor devices

Substrate interposer on a leadframe

Package including multiple semiconductor devices

Vertical and horizontal circuit assemblies

Thin semiconductor device packages

Semiconductor die package including low stress configuration

Packaged semiconductor devices and methods of manufacturing

Package including a semiconductor die and a capacitive component

Apparatus related to an improved package including a semiconductor die

Semiconductor die package and method for making the same

Semiconductor die package and method for making the same

Pre-molded clip structure

Semiconductor die package and method for making the same

Semiconductor die package including low stress configuration

Pre-molded clip structure

Semiconductor die package including exposed connections

Pre-molded clip structure

Pre-molded clip structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

CONCEALED GATE TERMINAL SEMICONDUCTOR PACKAGES AND RELATED METHODS

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SUBSTRATE INTERPOSER ON A LEADFRAME

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE C...

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

VERTICAL AND HORIZONTAL CIRCUIT ASSEMBLIES

THIN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE

SUBSTRATE INTERPOSER ON A LEADFRAME

PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE INCLUDING LOW STRESS CONFIGURATION

PRE-MOLDED CLIP STRUCTURE

PRE-MOLDED CLIP STRUCTURE

PRE-MOLDED CLIP STRUCTURE

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME