Maria Cristina ESTACIO

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Lapulapu City, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20230075519
- Publication date Mar 9, 2023
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20220406744
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS