Maria Guardado

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Organic packages having low tin solder connections
- Patent number 6,812,570
- Issue date Nov 2, 2004
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlled and programmed deposition of flux on a flip-chip die by...
- Patent number 6,722,553
- Issue date Apr 20, 2004
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method to metallize, reinforce, and hermetically seal...
- Patent number 6,671,450
- Issue date Dec 30, 2003
- Lightwave Microsystems Corporation
- Mohammad Zubair Khan
- G02 - OPTICS
Information Patent Grant
Method of reflowing organic packages using no-clean flux
- Patent number 6,617,195
- Issue date Sep 9, 2003
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightwave circuit assembly having low deformation balanced sandwich...
- Patent number 6,603,916
- Issue date Aug 5, 2003
- Lightwave Microsystems Corporation
- Kenneth McGreer
- G02 - OPTICS
Information Patent Grant
Boat for organic and ceramic flip chip package assembly
- Patent number 6,488,158
- Issue date Dec 3, 2002
- Advanced Micro Devices, Inc.
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for modifying a C4 semiconductor device
- Patent number 6,468,917
- Issue date Oct 22, 2002
- Advanced Micro Devices, Inc.
- Susan Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing flux residue by controlling amount of moisture during re...
- Patent number 6,409,070
- Issue date Jun 25, 2002
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow furnace with flux effluent collector and method of pr...
- Patent number 6,382,500
- Issue date May 7, 2002
- Advanced Micro Devices, Inc.
- Raj N. Master
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
No clean flux for flip chip assembly
- Patent number 6,103,549
- Issue date Aug 15, 2000
- Advanced Micro Devices, Inc.
- Raj N. Master
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated brush fluxing system for application of controlled amount...
- Patent number 6,098,867
- Issue date Aug 8, 2000
- Advanced Micro Devices, Inc.
- Raj N. Master
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Organic packages having low tin solder connections
- Publication number 20030037959
- Publication date Feb 27, 2003
- Raj N. Master
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS
- Publication number 20020170746
- Publication date Nov 21, 2002
- RAJ N MASTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method to metallize, reinforce, and hermetically seal...
- Publication number 20020051617
- Publication date May 2, 2002
- Mohammad Zubair Khan
- G02 - OPTICS
Information Patent Application
Controlled and programmed deposition of flux on a flip-chip die by...
- Publication number 20020031861
- Publication date Mar 14, 2002
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Maria Guardado

Person

Patents Grantslast 30 patents

Organic packages having low tin solder connections

Controlled and programmed deposition of flux on a flip-chip die by...

Apparatus and method to metallize, reinforce, and hermetically seal...

Method of reflowing organic packages using no-clean flux

Lightwave circuit assembly having low deformation balanced sandwich...

Boat for organic and ceramic flip chip package assembly

Method for modifying a C4 semiconductor device

Minimizing flux residue by controlling amount of moisture during re...

Solder reflow furnace with flux effluent collector and method of pr...

No clean flux for flip chip assembly

Automated brush fluxing system for application of controlled amount...

Patents Applicationslast 30 patents

Organic packages having low tin solder connections

ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS

Apparatus and method to metallize, reinforce, and hermetically seal...

Controlled and programmed deposition of flux on a flip-chip die by...