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Maria Heidenblut
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Schwarzenfeld, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer and method for processing a wafer
Patent number
10,600,701
Issue date
Mar 24, 2020
Infineon Technologies AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer and method for processing a wafer
Patent number
10,090,214
Issue date
Oct 2, 2018
Infineon Technologies AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Singulation processes
Patent number
9,040,389
Issue date
May 26, 2015
Infineon Technologies AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of etching a material surface
Patent number
8,183,156
Issue date
May 22, 2012
Infineon Technologies AG
Maria Heidenblut
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP WITH CRACK GUIDING STRUCTURE COMBINED WITH CRACK STOP STRUCTURE
Publication number
20240145408
Publication date
May 2, 2024
INFINEON TECHNOLOGIES AG
Maria HEIDENBLUT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP HAVING A CRACK STOP STRUCTURE
Publication number
20220270985
Publication date
Aug 25, 2022
Sergey Ananiev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER AND METHOD FOR PROCESSING A WAFER
Publication number
20180374766
Publication date
Dec 27, 2018
INFINEON TECHNOLOGIES AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER AND METHOD FOR PROCESSING A WAFER
Publication number
20140103495
Publication date
Apr 17, 2014
INFINEON TECHNOLOGIES AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Singulation Processes
Publication number
20140099777
Publication date
Apr 10, 2014
INFINEON TECHNOLOGIES AG
Gunther Mackh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Etching a Material Surface
Publication number
20090305510
Publication date
Dec 10, 2009
Maria Heidenblut
H01 - BASIC ELECTRIC ELEMENTS