Mariam G. Sadaka

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Trench process for dense VCSEL design
- Patent number 11,876,348
- Issue date Jan 16, 2024
- Apple Inc.
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor structures including cavities...
- Patent number 10,703,627
- Issue date Jul 7, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming bonded semiconductor structures, and semiconduct...
- Patent number 10,553,562
- Issue date Feb 4, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,818,874
- Issue date Nov 14, 2017
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabrication of semiconductor structures using laser lif...
- Patent number 9,728,458
- Issue date Aug 8, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming III-V semiconductor structures using multiple su...
- Patent number 9,716,164
- Issue date Jul 25, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures including MEMS devices...
- Patent number 9,511,996
- Issue date Dec 6, 2016
- Soitec
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming semiconductor structures including MEMS devices...
- Patent number 9,481,566
- Issue date Nov 1, 2016
- Soitec
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures including fluidic microchannels for coolin...
- Patent number 9,391,011
- Issue date Jul 12, 2016
- Soitec
- Mariam Sadaka
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,349,865
- Issue date May 24, 2016
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming three-dimensionally integrated semiconductor sys...
- Patent number 9,293,448
- Issue date Mar 22, 2016
- Soitec
- Bich-Yen Nguyen
- G02 - OPTICS
Information Patent Grant
Interposers including fluidic microchannels and related structures...
- Patent number 9,245,836
- Issue date Jan 26, 2016
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,219,150
- Issue date Dec 22, 2015
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including transisto...
- Patent number 9,165,945
- Issue date Oct 20, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of providing thin layers of crystalline semiconductor mater...
- Patent number 9,136,134
- Issue date Sep 15, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for forming integrated semiconductor structures
- Patent number 9,034,727
- Issue date May 19, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures and method of forming same
- Patent number 8,987,114
- Issue date Mar 24, 2015
- Soitec
- Carlos Mazure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including fluidic microchannels for coolin...
- Patent number 8,980,688
- Issue date Mar 17, 2015
- Soitec
- Mariam Sadaka
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Methods for fabrication of semiconductor structures including inter...
- Patent number 8,970,045
- Issue date Mar 3, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures and methods of forming same
- Patent number 8,890,299
- Issue date Nov 18, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures
- Patent number 8,866,305
- Issue date Oct 21, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming three dimensionally integrated semiconductor sys...
- Patent number 8,842,945
- Issue date Sep 23, 2014
- Soitec
- Bich-Yen Nguyen
- G02 - OPTICS
Information Patent Grant
Low temperature layer transfer process using donor structure with m...
- Patent number 8,841,742
- Issue date Sep 23, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for directly bonding together semiconductor structures, and...
- Patent number 8,778,773
- Issue date Jul 15, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bonded semiconductor structures including interc...
- Patent number 8,728,863
- Issue date May 20, 2014
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding semiconductor structures involving annealing pr...
- Patent number 8,716,105
- Issue date May 6, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding surfaces for direct bonding of semiconductor structures
- Patent number 8,697,493
- Issue date Apr 15, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of transferring layers of material in 3D integration proces...
- Patent number 8,673,733
- Issue date Mar 18, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Trench Process for Dense VCSEL Design
- Publication number 20220102940
- Publication date Mar 31, 2022
- Apple Inc.
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20200331750
- Publication date Oct 22, 2020
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20200168584
- Publication date May 28, 2020
- Sony Semiconductor Solutions Corporation
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...
- Publication number 20180012869
- Publication date Jan 11, 2018
- Sony Semiconductor Solutions Corporation
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...
- Publication number 20170210617
- Publication date Jul 27, 2017
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...
- Publication number 20160268430
- Publication date Sep 15, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...
- Publication number 20160087100
- Publication date Mar 24, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING TRANSISTO...
- Publication number 20160086974
- Publication date Mar 24, 2016
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING III-V SEMICONDUCTOR STRUCTURES USING MULTIPLE SU...
- Publication number 20150255591
- Publication date Sep 10, 2015
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20150228535
- Publication date Aug 13, 2015
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MEMS DEVICES...
- Publication number 20150210540
- Publication date Jul 30, 2015
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MEMS DEVICES...
- Publication number 20150191344
- Publication date Jul 9, 2015
- SOITEC
- Mariam Sadaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLIN...
- Publication number 20150179639
- Publication date Jun 25, 2015
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF SEMICONDUCTOR STRUCTURES USING LASER LIF...
- Publication number 20150179520
- Publication date Jun 25, 2015
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYS...
- Publication number 20140369646
- Publication date Dec 18, 2014
- Bich-Yen Nguyen
- G02 - OPTICS
Information Patent Application
INTERPOSERS INCLUDING FLUIDIC MICROCHANNELS AND RELATED STRUCTURES...
- Publication number 20140001642
- Publication date Jan 2, 2014
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLIN...
- Publication number 20140001604
- Publication date Jan 2, 2014
- SOITEC
- Mariam Sadaka
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES
- Publication number 20130299997
- Publication date Nov 14, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF SEMICONDUCTOR STRUCTURES INCLUDING INTER...
- Publication number 20130214423
- Publication date Aug 22, 2013
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROVIDING THIN LAYERS OF CRYSTALLINE SEMICONDUCTOR MATER...
- Publication number 20130217206
- Publication date Aug 22, 2013
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE LAYER TRANSFER PROCESS USING DONOR STRUCTURE WITH M...
- Publication number 20130175672
- Publication date Jul 11, 2013
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TRANSFERRING LAYERS OF MATERIAL IN 3D INTEGRATION PROCES...
- Publication number 20130075868
- Publication date Mar 28, 2013
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEM...
- Publication number 20130043600
- Publication date Feb 21, 2013
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATIO...
- Publication number 20130037960
- Publication date Feb 14, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS INCLUDING PHOT...
- Publication number 20130039615
- Publication date Feb 14, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Bich-Yen Nguyen
- G02 - OPTICS
Information Patent Application
METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING INTERC...
- Publication number 20130037959
- Publication date Feb 14, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SURFACES FOR DIRECT BONDING OF SEMICONDUCTOR STRUCTURES
- Publication number 20130020704
- Publication date Jan 24, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20130015442
- Publication date Jan 17, 2013
- SOITEC
- Carlos Mazure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20120313237
- Publication date Dec 13, 2012
- SOITEC
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Mariam G. Sadaka

Person

Patents Grantslast 30 patents

Trench process for dense VCSEL design

Methods of fabricating semiconductor structures including cavities...

Methods of forming bonded semiconductor structures, and semiconduct...

Method for fabricating semiconductor structures including fin struc...

Methods for fabrication of semiconductor structures using laser lif...

Methods of forming III-V semiconductor structures using multiple su...

Bonded processed semiconductor structures and carriers

Methods of forming semiconductor structures including MEMS devices...

Methods of forming semiconductor structures including MEMS devices...

Semiconductor structures including fluidic microchannels for coolin...

Method for fabricating semiconductor structures including fin struc...

Methods of forming three-dimensionally integrated semiconductor sys...

Interposers including fluidic microchannels and related structures...

Method for fabricating semiconductor structures including fin struc...

Method for fabricating semiconductor structures including transisto...

Methods of providing thin layers of crystalline semiconductor mater...

Bonded processed semiconductor structures and carriers

Methods and structures for forming integrated semiconductor structures

Bonded semiconductor structures and method of forming same

Semiconductor structures including fluidic microchannels for coolin...

Methods for fabrication of semiconductor structures including inter...

Bonded semiconductor structures and methods of forming same

Methods of forming bonded semiconductor structures

Methods of forming three dimensionally integrated semiconductor sys...

Low temperature layer transfer process using donor structure with m...

Methods for directly bonding together semiconductor structures, and...

Methods of forming bonded semiconductor structures including interc...

Methods for bonding semiconductor structures involving annealing pr...

Bonding surfaces for direct bonding of semiconductor structures

Methods of transferring layers of material in 3D integration proces...

Patents Applicationslast 30 patents

Trench Process for Dense VCSEL Design

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCT...

METHODS OF FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING CAVITIES...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING TRANSISTO...

METHODS OF FORMING III-V SEMICONDUCTOR STRUCTURES USING MULTIPLE SU...

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MEMS DEVICES...

METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MEMS DEVICES...

SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLIN...

METHODS FOR FABRICATION OF SEMICONDUCTOR STRUCTURES USING LASER LIF...

METHODS OF FORMING THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYS...

INTERPOSERS INCLUDING FLUIDIC MICROCHANNELS AND RELATED STRUCTURES...

SEMICONDUCTOR STRUCTURES INCLUDING FLUIDIC MICROCHANNELS FOR COOLIN...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

METHODS FOR FABRICATION OF SEMICONDUCTOR STRUCTURES INCLUDING INTER...

METHODS OF PROVIDING THIN LAYERS OF CRYSTALLINE SEMICONDUCTOR MATER...

LOW TEMPERATURE LAYER TRANSFER PROCESS USING DONOR STRUCTURE WITH M...

METHODS OF TRANSFERRING LAYERS OF MATERIAL IN 3D INTEGRATION PROCES...

BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEM...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATIO...

THREE DIMENSIONALLY INTEGRATED SEMICONDUCTOR SYSTEMS INCLUDING PHOT...

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING INTERC...

BONDING SURFACES FOR DIRECT BONDING OF SEMICONDUCTOR STRUCTURES

BONDED SEMICONDUCTOR STRUCTURES AND METHOD OF FORMING SAME

BONDED SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING SAME