Marie-Claude Paquet

Person

Bromont, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,750,615
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 10,368,441
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,974,179
- Issue date May 15, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for strain relieving surface mount attached co...
- Patent number 9,627,784
- Issue date Apr 18, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill adhesion measurements at a microscopic scale
- Patent number 8,796,049
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Maxime Cadotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,786,059
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow guide structures and method of using same
- Patent number 8,580,673
- Issue date Nov 12, 2013
- Ultratech, Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow guide structures and method of using same
- Patent number 8,409,980
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,236,615
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow guide structures
- Patent number 8,159,067
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,988,882
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,956,296
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,656,773
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20190281702
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20180213645
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...
- Publication number 20170196089
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20160049345
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20150255312
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE
- Publication number 20140030827
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Maxime CADOTTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20130161822
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME
- Publication number 20130122661
- Publication date May 16, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20120228748
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20120168956
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME
- Publication number 20120108015
- Publication date May 3, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER EXTENSION TO CHIP EDGE
- Publication number 20110298095
- Publication date Dec 8, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20110121469
- Publication date May 26, 2011
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME
- Publication number 20100038780
- Publication date Feb 18, 2010
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20050275091
- Publication date Dec 15, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer holding of integrated circuit packages
- Publication number 20040071805
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20020192876
- Publication date Dec 19, 2002
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS

Marie-Claude Paquet

Person

Patents Grantslast 30 patents

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Method and apparatus for strain relieving surface mount attached co...

Low-stress dual underfill packaging

Method and apparatus for strain relieving surface mount attached co...

Low-stress dual underfill packaging

Underfill adhesion measurements at a microscopic scale

Passivation layer surface topography modifications for improved int...

Underfill flow guide structures and method of using same

Underfill flow guide structures and method of using same

Passivation layer surface topography modifications for improved int...

Underfill flow guide structures

Transfer molding of integrated circuit packages

Transfer molding of integrated circuit packages

Transfer molding of integrated circuit packages

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CO...

LOW-STRESS DUAL UNDERFILL PACKAGING

LOW-STRESS DUAL UNDERFILL PACKAGING

UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME

PASSIVATION LAYER EXTENSION TO CHIP EDGE

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

UNDERFILL FLOW GUIDE STRUCTURES AND METHOD OF USING SAME

Transfer molding of integrated circuit packages

Transfer holding of integrated circuit packages

Transfer molding of integrated circuit packages