Marie-France Boyaud

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Bromont, CA

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Patents Grantslast 30 patents

Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,988,882
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,956,296
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molding of integrated circuit packages
- Patent number 6,656,773
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20050275091
- Publication date Dec 15, 2005
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer holding of integrated circuit packages
- Publication number 20040071805
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer molding of integrated circuit packages
- Publication number 20020192876
- Publication date Dec 19, 2002
- Marie-France Boyaud
- H01 - BASIC ELECTRIC ELEMENTS