Mariko TESHIBA

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Ibaraki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pressure-sensitive adhesive sheet for semiconductor wafer processing
- Patent number 11,898,071
- Issue date Feb 13, 2024
- Nitto Denko Corporation
- Mariko Teshiba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKGRINDING TAPE
- Publication number 20230107095
- Publication date Apr 6, 2023
- Nitto Denko Corporation
- Mariko TESHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION TO BE USED IN PRESSURE-SENS...
- Publication number 20230108829
- Publication date Apr 6, 2023
- Nitto Denko Corporation
- Mariko TESHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROCESSING
- Publication number 20220403214
- Publication date Dec 22, 2022
- Nitto Denko Corporation
- Mariko TESHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE
- Publication number 20210277288
- Publication date Sep 9, 2021
- Nitto Denko Corporation
- Mariko TESHIBA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...