Marina Sakamaki

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Saitama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20250024610
- Publication date Jan 16, 2025
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...
- Publication number 20240178115
- Publication date May 30, 2024
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20230411266
- Publication date Dec 21, 2023
- MITSUBISHI MATERIALS CORPORATION
- Yoshiaki Sakaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20230164924
- Publication date May 25, 2023
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR