Mario A. Bolanos

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sproutless pre-packaged molding for component encapsulation
- Patent number 6,531,083
- Issue date Mar 11, 2003
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing prepackaged molding compound for component...
- Patent number 5,965,078
- Issue date Oct 12, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pre-packaged liquid molding for component encapsulation
- Patent number 5,955,115
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dambarless leadframe for molded component encapsulation
- Patent number 5,949,132
- Issue date Sep 7, 1999
- Texas Instruments Incorporated
- Jeremias L. Libres
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sproutless pre-packaged molding for component encapsulation
- Patent number 5,912,024
- Issue date Jun 15, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dambarless leadframe for molded component encapsulation
- Patent number 5,891,377
- Issue date Apr 6, 1999
- Texas Instruments Incorporated
- Jeremias L. Libres
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing prepackaged molding compound for component...
- Patent number 5,888,443
- Issue date Mar 30, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pre-packaged molding for component encapsulation
- Patent number 5,885,506
- Issue date Mar 23, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mechanical interlocking of fillers and epoxy/resin
- Patent number 5,644,168
- Issue date Jul 1, 1997
- Texas Instruments Incorporated
- Jeremias P. Libres
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS

Mario A. Bolanos

Person

Patents Grantslast 30 patents

Sproutless pre-packaged molding for component encapsulation

Method for manufacturing prepackaged molding compound for component...

Pre-packaged liquid molding for component encapsulation

Dambarless leadframe for molded component encapsulation

Sproutless pre-packaged molding for component encapsulation

Dambarless leadframe for molded component encapsulation

Method for manufacturing prepackaged molding compound for component...

Pre-packaged molding for component encapsulation

Mechanical interlocking of fillers and epoxy/resin

Patents Applicationslast 30 patents

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...