Mario Arwin FABIAN

Person

  • Singapore, SG

Patents Grantslast 30 patents

  • Information Patent Grant

    Reliable semiconductor packages

    • Patent number 12,021,096
    • Issue date Jun 25, 2024
    • UTAC HEADQUARTERS PTE. LTD.
    • Dennis Fernandez Tresnado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reliable semiconductor packages

    • Patent number 11,177,301
    • Issue date Nov 16, 2021
    • UTAC HEADQUARTERS PTE. LTD.
    • Hua Hong Tan
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    RELIABLE SEMICONDUCTOR PACKAGES

    • Publication number 20210391368
    • Publication date Dec 16, 2021
    • UTAC Headquarters Pte. Ltd.
    • Dennis Fernandez TRESNADO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RELIABLE SEMICONDUCTOR PACKAGES

    • Publication number 20200161351
    • Publication date May 21, 2020
    • UTAC Headquarters Pte. Ltd.
    • Hua Hong TAN
    • H01 - BASIC ELECTRIC ELEMENTS