Mario Ciminelli

Person

Rochester, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication of an inkjet printhead mounting substrate
- Patent number 8,887,393
- Issue date Nov 18, 2014
- Eastman Kodak Company
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet printhead with layered ceramic mounting substrate
- Patent number 8,721,042
- Issue date May 13, 2014
- Eastman Kodak Company
- Dwight J. Petruchik
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet printhead with multi-layer mounting substrate
- Patent number 8,690,296
- Issue date Apr 8, 2014
- Eastman Kodak Company
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Corrosion protected flexible printed wiring member
- Patent number 8,662,640
- Issue date Mar 4, 2014
- Eastman Kodak Company
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Metalized printhead substrate overmolded with plastic
- Patent number 8,496,317
- Issue date Jul 30, 2013
- Eastman Kodak Company
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of protecting printhead die face
- Patent number 8,438,730
- Issue date May 14, 2013
- Eastman Kodak Company
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Die mounting assembly formed of dissimilar materials
- Patent number 8,430,474
- Issue date Apr 30, 2013
- Eastman Kodak Company
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Insert molded printhead substrate
- Patent number 8,246,141
- Issue date Aug 21, 2012
- Eastman Kodak Company
- Dwight J. Petruchik
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejection assembly having a mounting substrate
- Patent number 8,118,406
- Issue date Feb 21, 2012
- Eastman Kodak Company
- Mario J. Ciminelli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Inclined feature to protect printhead face
- Patent number 7,862,147
- Issue date Jan 4, 2011
- Eastman Kodak Company
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid-ejecting device with simplified connectivity
- Patent number 7,810,910
- Issue date Oct 12, 2010
- Eastman Kodak Company
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Large area flat image sensor assembly
- Patent number 7,276,394
- Issue date Oct 2, 2007
- Eastman Kodak Company
- Jaime I. Waldman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF AN INKJET PRINTHEAD MOUNTING SUBSTRATE
- Publication number 20130193105
- Publication date Aug 1, 2013
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKJET PRINTHEAD WITH MULTI-LAYER MOUNTING SUBSTRATE
- Publication number 20130194349
- Publication date Aug 1, 2013
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CORROSION PROTECTED FLEXIBLE PRINTED WIRING MEMBER
- Publication number 20130187988
- Publication date Jul 25, 2013
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF FABRICATING A LAYERED CERAMIC SUBSTRATE
- Publication number 20130025125
- Publication date Jan 31, 2013
- Dwight J. Petruchik
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKJET PRINTHEAD WITH LAYERED CERAMIC MOUNTING SUBSTRATE
- Publication number 20130027466
- Publication date Jan 31, 2013
- Dwight J. Petruchik
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF PROTECTING PRINTHEAD DIE FACE
- Publication number 20120186079
- Publication date Jul 26, 2012
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKJET PRINTHEAD WITH PROTECTIVE SPACER
- Publication number 20120188307
- Publication date Jul 26, 2012
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DIE MOUNTING ASSEMBLY FORMED OF DISSIMILAR MATERIALS
- Publication number 20110304673
- Publication date Dec 15, 2011
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLUID EJECTION ASSEMBLY HAVING A MOUNTING SUBSTRATE
- Publication number 20110080450
- Publication date Apr 7, 2011
- Mario J. Ciminelli
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METALIZED PRINTHEAD SUBSTRATE OVERMOLDED WITH PLASTIC
- Publication number 20110037808
- Publication date Feb 17, 2011
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INCLINED FEATURE TO PROTECT PRINTHEAD FACE
- Publication number 20100079542
- Publication date Apr 1, 2010
- Mario Joseph Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLUID FLOW PATH IN MICROFLUIDIC DEVICE
- Publication number 20080202694
- Publication date Aug 28, 2008
- Jeffrey P. Serbicki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD WIREBOND ENCAPSULATION
- Publication number 20080158298
- Publication date Jul 3, 2008
- Jeffrey P. Serbicki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INSERT MOLDED PRINTHEAD SUBSTRATE
- Publication number 20080149024
- Publication date Jun 26, 2008
- Dwight J. Petruchik
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LARGE AREA FLAT IMAGE SENSOR ASSEMBLY
- Publication number 20080012082
- Publication date Jan 17, 2008
- Jaime I. Waldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-EJECTING DEVICE WITH SIMPLIFIED CONNECTIVITY
- Publication number 20080001999
- Publication date Jan 3, 2008
- Eastman Kodak Company
- Mario J. Ciminelli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Large area flat image sensor assembly
- Publication number 20050019987
- Publication date Jan 27, 2005
- Eastman Kodak Company
- Jaime I. Waldman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an image sensor assembly
- Publication number 20030054583
- Publication date Mar 20, 2003
- Eastman Kodak Company
- Jaime I. Waldman
- H01 - BASIC ELECTRIC ELEMENTS

Mario Ciminelli

Person

Patents Grantslast 30 patents

Fabrication of an inkjet printhead mounting substrate

Inkjet printhead with layered ceramic mounting substrate

Inkjet printhead with multi-layer mounting substrate

Corrosion protected flexible printed wiring member

Metalized printhead substrate overmolded with plastic

Method of protecting printhead die face

Die mounting assembly formed of dissimilar materials

Insert molded printhead substrate

Fluid ejection assembly having a mounting substrate

Inclined feature to protect printhead face

Fluid-ejecting device with simplified connectivity

Large area flat image sensor assembly

Patents Applicationslast 30 patents

FABRICATION OF AN INKJET PRINTHEAD MOUNTING SUBSTRATE

INKJET PRINTHEAD WITH MULTI-LAYER MOUNTING SUBSTRATE

CORROSION PROTECTED FLEXIBLE PRINTED WIRING MEMBER

METHOD OF FABRICATING A LAYERED CERAMIC SUBSTRATE

INKJET PRINTHEAD WITH LAYERED CERAMIC MOUNTING SUBSTRATE

METHOD OF PROTECTING PRINTHEAD DIE FACE

INKJET PRINTHEAD WITH PROTECTIVE SPACER

DIE MOUNTING ASSEMBLY FORMED OF DISSIMILAR MATERIALS

FLUID EJECTION ASSEMBLY HAVING A MOUNTING SUBSTRATE

METALIZED PRINTHEAD SUBSTRATE OVERMOLDED WITH PLASTIC

INCLINED FEATURE TO PROTECT PRINTHEAD FACE

FLUID FLOW PATH IN MICROFLUIDIC DEVICE

PRINTHEAD WIREBOND ENCAPSULATION

INSERT MOLDED PRINTHEAD SUBSTRATE

LARGE AREA FLAT IMAGE SENSOR ASSEMBLY

FLUID-EJECTING DEVICE WITH SIMPLIFIED CONNECTIVITY

Large area flat image sensor assembly

Method for producing an image sensor assembly