Mario E. Ecker

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate-embedded pluggable receptacles for connecting clustered e...
- Patent number 5,842,881
- Issue date Dec 1, 1998
- International Business Machines Corporation
- Mario Enrique Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large ceramic article and method of manufacturing
- Patent number 5,541,005
- Issue date Jul 30, 1996
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large ceramic articles and method of manufacturing
- Patent number 5,439,636
- Issue date Aug 8, 1995
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable connectors for connecting large numbers of electrical and...
- Patent number 5,396,573
- Issue date Mar 7, 1995
- International Business Machines Corporation
- Mario E. Ecker
- G02 - OPTICS
Information Patent Grant
Matrix of pluggable connectors for connecting large numbers of clus...
- Patent number 5,337,388
- Issue date Aug 9, 1994
- International Business Machines Corporation
- Lawrence Jacobowitz
- G02 - OPTICS
Information Patent Grant
Substrate-embedded pluggable receptacles for connecting clustered o...
- Patent number 5,333,225
- Issue date Jul 26, 1994
- International Business Machines Corporation
- Lawrence Jacobowitz
- G02 - OPTICS
Information Patent Grant
Apparatus and a method for an electrical transmission-line interface
- Patent number 5,304,969
- Issue date Apr 19, 1994
- International Business Machines Corporation
- Lawrence Jacobowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and a method for an optical fiber interface
- Patent number 5,241,614
- Issue date Aug 31, 1993
- International Business Machines Corporation
- Mario E. Ecker
- G02 - OPTICS
Information Patent Grant
Apparatus and a method for an electrical transmission-line interface
- Patent number 5,173,668
- Issue date Dec 22, 1992
- International Business Machines Corporation
- Lawrence Jacobowitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and a method for an optical fiber interface
- Patent number 5,155,786
- Issue date Oct 13, 1992
- International Business Machines Corporation
- Mario E. Ecker
- G02 - OPTICS
Information Patent Grant
De-coupled printed circuits
- Patent number 4,785,135
- Issue date Nov 15, 1988
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic EC for minimizing EC pads
- Patent number 4,746,815
- Issue date May 24, 1988
- International Business Machines Corporation
- Harsaran S. Bhatia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Repairable multi-level overlay system for semiconductor device
- Patent number 4,549,200
- Issue date Oct 22, 1985
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection means for chip carriers
- Patent number 4,377,316
- Issue date Mar 22, 1983
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 4,251,852
- Issue date Feb 17, 1981
- International Business Machines Corporation
- Mario E. Ecker
- H01 - BASIC ELECTRIC ELEMENTS

Mario E. Ecker

Person

Patents Grantslast 30 patents

Substrate-embedded pluggable receptacles for connecting clustered e...

Large ceramic article and method of manufacturing

Large ceramic articles and method of manufacturing

Pluggable connectors for connecting large numbers of electrical and...

Matrix of pluggable connectors for connecting large numbers of clus...

Substrate-embedded pluggable receptacles for connecting clustered o...

Apparatus and a method for an electrical transmission-line interface

Apparatus and a method for an optical fiber interface

Apparatus and a method for an electrical transmission-line interface

Apparatus and a method for an optical fiber interface

De-coupled printed circuits

Electronic EC for minimizing EC pads

Repairable multi-level overlay system for semiconductor device

High density interconnection means for chip carriers

Integrated circuit package