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Patents Grantslast 30 patents

Information Patent Grant
Solder bump arrangements for large area analog circuitry
- Patent number 9,343,418
- Issue date May 17, 2016
- Xilinx, Inc.
- Donnacha Lowney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrity monitor with sacrificial bumps
- Patent number 9,128,148
- Issue date Sep 8, 2015
- Xilinx, Inc.
- Donnacha Lowney
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BUMP ARRANGEMENTS FOR LARGE AREA ANALOG CIRCUITRY
- Publication number 20150123265
- Publication date May 7, 2015
- Xilinx, Inc.
- Donnacha Lowney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRITY MONITOR WITH SACRIFICIAL BUMPS
- Publication number 20140253171
- Publication date Sep 11, 2014
- Xilinx, Inc.
- Donnacha Lowney
- G01 - MEASURING TESTING