Marites Laguipo Roque

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with side solderable leads and...
- Patent number 9,048,228
- Issue date Jun 2, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Inverted EWLB Package wi...
- Publication number 20250006608
- Publication date Jan 2, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SIDE SOLDERABLE LEADS AND...
- Publication number 20150084172
- Publication date Mar 26, 2015
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS