Mark A. DiRocco

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South Burlington, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Signal monitoring of through-wafer vias using a multi-layer inductor
- Patent number 9,658,255
- Issue date May 23, 2017
- International Business Machines Corporation
- Mark A. DiRocco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal monitoring of through-wafer vias using a multi-layer inductor
- Patent number 9,372,208
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Grant
Methods for testing integrated circuits of wafer and testing struct...
- Patent number 9,269,642
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Michael T. Coster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information encoding using wirebonds
- Patent number 8,937,010
- Issue date Jan 20, 2015
- International Business Machines Corporation
- William E. Bentley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR
- Publication number 20150362534
- Publication date Dec 17, 2015
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Application
SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR
- Publication number 20150185273
- Publication date Jul 2, 2015
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR TESTING INTEGRATED CIRCUITS OF WAFER AND TESTING STRUCT...
- Publication number 20140367684
- Publication date Dec 18, 2014
- Michael T. Coster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION ENCODING USING WIREBONDS
- Publication number 20140239469
- Publication date Aug 28, 2014
- International Business Machines Corporation
- William E. Bentley
- G06 - COMPUTING CALCULATING COUNTING