Mark A. Eshelman

Follow

Person

Lansdale, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 7,199,475
- Issue date Apr 3, 2007
- Kulicke and Soffa Industries, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,885,104
- Issue date Apr 26, 2005
- Kulicke and Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,534,877
- Issue date Mar 18, 2003
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,413,576
- Issue date Jul 2, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper band pad surface protection
- Patent number 6,352,743
- Issue date Mar 5, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing Cr-bearing layer
- Patent number 5,413,821
- Issue date May 9, 1995
- Iowa State University Research Foundation, Inc.
- Timothy W. Ellis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20050181191
- Publication date Aug 18, 2005
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020168845
- Publication date Nov 14, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020135077
- Publication date Sep 26, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
- Publication number 20020054955
- Publication date May 9, 2002
- TIMOTHY W. ELLIS
- H01 - BASIC ELECTRIC ELEMENTS