Mark A. Spak

Person

Edison, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photoresist composition for imaging thick films
- Patent number 6,852,465
- Issue date Feb 8, 2005
- Clariant International Ltd.
- Ralph R. Dammel
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lift-off process for patterning fine metal lines
- Patent number 6,372,414
- Issue date Apr 16, 2002
- Clariant Finance (BVI) Limited
- Randy D. Redd
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Antireflective coating for photoresist compositions
- Patent number 6,187,506
- Issue date Feb 13, 2001
- Clariant Finance (BVI) Limited
- Shuji Ding
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for obtaining a lift-off imaging profile
- Patent number 5,922,503
- Issue date Jul 13, 1999
- Clariant Finance (BVI) Limited
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal negative working photoresist containing O-quinone di...
- Patent number 5,399,456
- Issue date Mar 21, 1995
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal negative working O-naphthoquinone diazide and cross-...
- Patent number 5,256,522
- Issue date Oct 26, 1993
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal negative working o-quinone diazide and cross-linking...
- Patent number 5,217,840
- Issue date Jun 8, 1993
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of producing an image reversal negative photoresist having a...
- Patent number 5,019,488
- Issue date May 28, 1991
- Hoechst Celanese Corporation
- Donald C. Mammato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal negative working O-quinone diazide and cross-linking...
- Patent number 4,931,381
- Issue date Jun 5, 1990
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Image reversal negative working O-napthoquinone diazide and cross-l...
- Patent number 4,929,536
- Issue date May 29, 1990
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High temperature post exposure baking treatment for positive photor...
- Patent number 4,885,232
- Issue date Dec 5, 1989
- Hoechst Celanese Corporation
- Mark A. Spak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Aqueous edge bead remover
- Publication number 20050282093
- Publication date Dec 22, 2005
- Ralph R. Dammel
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photoresist composition for imaging thick films
- Publication number 20040185368
- Publication date Sep 23, 2004
- Ralph R. Dammel
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Mark A. Spak

Person

Patents Grantslast 30 patents

Photoresist composition for imaging thick films

Lift-off process for patterning fine metal lines

Antireflective coating for photoresist compositions

Process for obtaining a lift-off imaging profile

Image reversal negative working photoresist containing O-quinone di...

Image reversal negative working O-naphthoquinone diazide and cross-...

Image reversal negative working o-quinone diazide and cross-linking...

Method of producing an image reversal negative photoresist having a...

Image reversal negative working O-quinone diazide and cross-linking...

Image reversal negative working O-napthoquinone diazide and cross-l...

High temperature post exposure baking treatment for positive photor...

Patents Applicationslast 30 patents

Aqueous edge bead remover

Photoresist composition for imaging thick films