Mark BEESLEY

Person

Carmel Valley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for manufacturing thin substrate
- Patent number 12,035,466
- Issue date Jul 9, 2024
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components attached to fabric
- Patent number 11,388,817
- Issue date Jul 12, 2022
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,959,331
- Issue date Mar 23, 2021
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,701,802
- Issue date Jun 30, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Grant
Electrical components attached to fabric
- Patent number 10,485,103
- Issue date Nov 19, 2019
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Grant
Connection pad for embedded components in PCB packaging
- Patent number 10,455,707
- Issue date Oct 22, 2019
- Apple Inc.
- Kenneth Leland Kiplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented via for vertical PCB interconnect
- Patent number 10,420,213
- Issue date Sep 17, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric devices with shape memory alloy wires that provide haptic fe...
- Patent number 10,191,550
- Issue date Jan 29, 2019
- Apple Inc.
- Michael B. Nussbaum
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED WATERPROOF MEMBRANE
- Publication number 20240314479
- Publication date Sep 19, 2024
- Apple Inc.
- Gregory B. ARNDT
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20220346228
- Publication date Oct 27, 2022
- Apple Inc.
- Daniel D. Sunshine
- D03 - WEAVING
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING THIN SUBSTRATE
- Publication number 20220104346
- Publication date Mar 31, 2022
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20220095455
- Publication date Mar 24, 2022
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20210185808
- Publication date Jun 17, 2021
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20200329559
- Publication date Oct 15, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
Electrical Components Attached to Fabric
- Publication number 20200084886
- Publication date Mar 12, 2020
- Apple Inc.
- Daniel D. Sunshine
- A41 - WEARING APPAREL
Information Patent Application
SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT
- Publication number 20190075653
- Publication date Mar 7, 2019
- Apple Inc.
- Mark J. Beesley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE SHAPING OF DEVICE PACKAGES TO MITIGATE FRACTURES UNDER BEND...
- Publication number 20170083042
- Publication date Mar 23, 2017
- Apple Inc.
- Shawn X. ARNOLD
- G06 - COMPUTING CALCULATING COUNTING

Mark BEESLEY

Person

Patents Grantslast 30 patents

Systems and methods for manufacturing thin substrate

Three-dimensional (3D) copper in printed circuit boards

Electrical components attached to fabric

Electrical components attached to fabric

Electrical components attached to fabric

Electrical components attached to fabric

Connection pad for embedded components in PCB packaging

Segmented via for vertical PCB interconnect

Fabric devices with shape memory alloy wires that provide haptic fe...

Patents Applicationslast 30 patents

EMBEDDED WATERPROOF MEMBRANE

Three-Dimensional (3D) Copper in Printed Circuit Boards

Electrical Components Attached to Fabric

SYSTEMS AND METHODS FOR MANUFACTURING THIN SUBSTRATE

Three-Dimensional (3D) Copper in Printed Circuit Boards

Electrical Components Attached to Fabric

Electrical Components Attached to Fabric

Electrical Components Attached to Fabric

SEGMENTED VIA FOR VERTICAL PCB INTERCONNECT

SURFACE SHAPING OF DEVICE PACKAGES TO MITIGATE FRACTURES UNDER BEND...