TREA

Mark Carroll

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  • Charlestown, MA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Thin Film Solder Bond
    • Publication number 20180226533
    • Publication date Aug 9, 2018
    • AMBERWAVE INC.
    • Anthony Lochtefeld
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Inducement of Strain in a Semiconductor Layer
    • Publication number 20140147981
    • Publication date May 29, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • James Fiorenza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thin Film Solder Bond
    • Publication number 20120273043
    • Publication date Nov 1, 2012
    • AMBERWAVE INC.
    • Anthony Lochtefeld
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Inducement of Strain in a Semiconductor Layer
    • Publication number 20110114996
    • Publication date May 19, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • James Fiorenza
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Inducement of Strain in a Semiconductor Layer
    • Publication number 20080135873
    • Publication date Jun 12, 2008
    • AmberWave Systems Corporation
    • James Fiorenza
    • H01 - BASIC ELECTRIC ELEMENTS