Mark Chou

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Kaoshiang City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wirebond pad for semiconductor chip or wafer
- Patent number 8,187,965
- Issue date May 29, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond pad for semiconductor chip or wafer
- Patent number 7,554,208
- Issue date Jun 30, 2009
- Megica Corp.
- Mark Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond pad for semiconductor chip or wafer
- Patent number 7,470,997
- Issue date Dec 30, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER
- Publication number 20090053887
- Publication date Feb 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER
- Publication number 20070252281
- Publication date Nov 1, 2007
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-passivation metal scheme on an IC chip with copper interconnec...
- Publication number 20050017361
- Publication date Jan 27, 2005
- MEGIC Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS