Mark D. Crook

Person

Ft. Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shallow semiconductor sensor with fluorescent molecule layer that e...
- Patent number 7,768,084
- Issue date Aug 3, 2010
- Aptina Imaging Corporation, Inc.
- Russell W. Gruhlke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical enhancement of integrated circuit photodetectors
- Patent number 7,704,780
- Issue date Apr 27, 2010
- Aptina Imaging Corporation
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical enhancement of integrated circuit photodetectors
- Patent number 7,459,733
- Issue date Dec 2, 2008
- Aptina Imaging Corporation
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical enhancement of integrated circuit photodetectors
- Patent number 7,208,783
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
- Patent number 6,903,017
- Issue date Jun 7, 2005
- Agilent Technologies, Inc.
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
- Patent number 6,646,346
- Issue date Nov 11, 2003
- Agilent Technologies, Inc.
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Incorporation of dielectric layers in a semiconductor
- Patent number 5,110,712
- Issue date May 5, 1992
- Hewlett-Packard Company
- Daniel D. Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnection system with a planar surface
- Patent number 5,084,414
- Issue date Jan 28, 1992
- Hewlett-Packard Company
- Robert B. Manley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ENHANCEMENT OF INTEGRATED CIRCUIT PHOTODETECTORS
- Publication number 20090081822
- Publication date Mar 26, 2009
- APTINA IMAGING CORPORATION
- CHINTAMANI PALSULE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shallow semiconductor sensor with fluorescent molecule layer that e...
- Publication number 20070278607
- Publication date Dec 6, 2007
- Russell W. Gruhlke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical enhancement of integrated circuit photodetectors
- Publication number 20070158696
- Publication date Jul 12, 2007
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating low leakage interconnect layers in integrate...
- Publication number 20070020920
- Publication date Jan 25, 2007
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating low leakage interconnect layers in integrate...
- Publication number 20060099800
- Publication date May 11, 2006
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical enhancement of integrated circuit photodetectors
- Publication number 20060097244
- Publication date May 11, 2006
- Chintamani Palsule
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit metallization using a titanium/alminum alloy
- Publication number 20040038453
- Publication date Feb 26, 2004
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS

Mark D. Crook

Person

Patents Grantslast 30 patents

Shallow semiconductor sensor with fluorescent molecule layer that e...

Optical enhancement of integrated circuit photodetectors

Optical enhancement of integrated circuit photodetectors

Optical enhancement of integrated circuit photodetectors

Integrated circuit metallization using a titanium/aluminum alloy

Integrated circuit metallization using a titanium/aluminum alloy

Incorporation of dielectric layers in a semiconductor

Metal interconnection system with a planar surface

Patents Applicationslast 30 patents

OPTICAL ENHANCEMENT OF INTEGRATED CIRCUIT PHOTODETECTORS

Shallow semiconductor sensor with fluorescent molecule layer that e...

Optical enhancement of integrated circuit photodetectors

Method for fabricating low leakage interconnect layers in integrate...

Method for fabricating low leakage interconnect layers in integrate...

Optical enhancement of integrated circuit photodetectors

Integrated circuit metallization using a titanium/alminum alloy