Mark D. Schultz

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduced pressure drop cold plate transition
- Patent number 12,158,314
- Issue date Dec 3, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Rotating lid for module cooler
- Patent number 12,028,997
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate with uniform plenum flow
- Patent number 12,004,322
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Co-packaged optical module
- Patent number 11,923,269
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary removable module lid
- Patent number 11,800,666
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center coolant switch
- Patent number 11,737,248
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Reduced pressure drop cold plate transition
- Patent number 11,698,233
- Issue date Jul 11, 2023
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Variable pin fin construction to facilitate compliant cold plates
- Patent number 11,515,230
- Issue date Nov 29, 2022
- International Business Machines Corporation
- Mark Delorman Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface formed by condensate
- Patent number 11,508,643
- Issue date Nov 22, 2022
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically flexible cold plates for low power components
- Patent number 11,497,143
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer scale supercomputer
- Patent number 11,335,657
- Issue date May 17, 2022
- International Business Machines Corporation
- Evan Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern bonded finned cold plate
- Patent number 11,278,978
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark D. Schultz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Energy efficiency based control for a cooling system
- Patent number 11,277,944
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Timothy J. Chainer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module lid with embedded two-phase cooling and insulating layer
- Patent number 11,201,102
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Pritish R. Parida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Compliant pin fin heat sink and methods
- Patent number 11,158,565
- Issue date Oct 26, 2021
- International Business Machines Corporation
- John P. Karidis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Burst resistant thin wall heat sink
- Patent number 11,131,506
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Paul W. Coteus
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Large channel interconnects with through silicon Vias (TSVs) and me...
- Patent number 11,127,715
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data center coolant switch
- Patent number 11,013,152
- Issue date May 18, 2021
- International Business Machines Corporation
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System level model for pumped two-phase cooling systems
- Patent number 11,009,926
- Issue date May 18, 2021
- International Business Machines Corporation
- Timothy Joseph Chainer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compliant Pin Fin heat sink with base integral pins
- Patent number 10,991,639
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive heat spreader and heat sink assembly for optical devices
- Patent number 10,937,671
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Fuad Elias Doany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density, fail-in-place switches for computer and data networks
- Patent number 10,749,817
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Paul W. Coteus
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,158
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,159
- Issue date Jul 28, 2020
- International Business Machines Corporatin
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase liquid cooled electronics
- Patent number 10,701,832
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Timothy Joseph Chainer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Energy efficiency based control for a cooling system
- Patent number 10,653,044
- Issue date May 12, 2020
- International Business Machines Corporation
- Timothy J. Chainer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically flexible cold plates for low power components
- Patent number 10,631,438
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package for two-phase cooling and assembly process thereof
- Patent number 10,607,963
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System level model for pumped two-phase cooling systems
- Patent number 10,585,462
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Timothy Joseph Chainer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,529,648
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSOR MODULE INSTALLATION TOOL WITH PROTECTIVE INTERLOCK FEATURE
- Publication number 20240397686
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE WITH UNIFORM PLENUM FLOW
- Publication number 20240298423
- Publication date Sep 5, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPLIANT COUNTER-FLOW COLD PLATE
- Publication number 20240098935
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
REDUCED PRESSURE DROP COLD PLATE TRANSITION
- Publication number 20230296332
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WAFER TO WAFER HIGH DENSITY INTERCONNECTS
- Publication number 20230207523
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED...
- Publication number 20230184833
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Mark D. Schultz
- G01 - MEASURING TESTING
Information Patent Application
ROTATING LID FOR MODULE COOLER
- Publication number 20220418134
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPORARY REMOVABLE MODULE LID
- Publication number 20220418129
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Noah Singer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CO-PACKAGED OPTICAL MODULE
- Publication number 20220328375
- Publication date Oct 13, 2022
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE WITH UNIFORM PLENUM FLOW
- Publication number 20220210946
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
REDUCED PRESSURE DROP COLD PLATE TRANSITION
- Publication number 20220205740
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WAFER SCALE SUPERCOMPUTER
- Publication number 20220084969
- Publication date Mar 17, 2022
- International Business Machines Corporation
- Evan Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA CENTER COOLANT SWITCH
- Publication number 20210243919
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PATTERN BONDED FINNED COLD PLATE
- Publication number 20200400387
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ENERGY EFFICIENCY BASED CONTROL FOR A COOLING SYSTEM
- Publication number 20200253092
- Publication date Aug 6, 2020
- International Business Machines Corporation
- Timothy J. Chainer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS
- Publication number 20200221610
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL INTERFACE FORMED BY CONDENSATE
- Publication number 20200211924
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEM LEVEL MODEL FOR PUMPED TWO-PHASE COOLING SYSTEMS
- Publication number 20200166975
- Publication date May 28, 2020
- International Business Machines Corporation
- Timothy Joseph Chainer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200118907
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200091037
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE PIN FIN CONSTRUCTION TO FACILITATE COMPLIANT COLD PLATES
- Publication number 20200091032
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Mark Delorman Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA CENTER COOLANT SWITCH
- Publication number 20200029470
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Module Lid with Embedded Two-Phase Cooling and Insulating Layer
- Publication number 20190348345
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Pritish R. Parida
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TWO-PHASE LIQUID COOLED ELECTRONICS
- Publication number 20190230816
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Timothy J. Chainer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE HEAT SPREADER AND HEAT SINK ASSEMBLY FOR OPTICAL DEVICES
- Publication number 20190214280
- Publication date Jul 11, 2019
- International Business Machines Corporation
- Fuad Elias Doany
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS
- Publication number 20190200485
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Paul W. Coteus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURST RESISTANT THIN WALL HEAT SINK
- Publication number 20190154340
- Publication date May 23, 2019
- International Business Machines Corporation
- Paul W. Coteus
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20190139938
- Publication date May 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS
- Publication number 20190020597
- Publication date Jan 17, 2019
- International Business Machines Corporation
- Paul W. Coteus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL INTEGRATION FOR EMBEDDED COOLING
- Publication number 20180294205
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Timothy Joseph Chainer
- H01 - BASIC ELECTRIC ELEMENTS

Mark D. Schultz

Person

Patents Grantslast 30 patents

Reduced pressure drop cold plate transition

Rotating lid for module cooler

Cold plate with uniform plenum flow

Co-packaged optical module

Temporary removable module lid

Data center coolant switch

Reduced pressure drop cold plate transition

Variable pin fin construction to facilitate compliant cold plates

Thermal interface formed by condensate

Mechanically flexible cold plates for low power components

Wafer scale supercomputer

Pattern bonded finned cold plate

Energy efficiency based control for a cooling system

Module lid with embedded two-phase cooling and insulating layer

Compliant pin fin heat sink and methods

Burst resistant thin wall heat sink

Large channel interconnects with through silicon Vias (TSVs) and me...

Data center coolant switch

System level model for pumped two-phase cooling systems

Compliant Pin Fin heat sink with base integral pins

Conductive heat spreader and heat sink assembly for optical devices

High-density, fail-in-place switches for computer and data networks

Counter-flow expanding channels for enhanced two-phase heat removal

Counter-flow expanding channels for enhanced two-phase heat removal

Two-phase liquid cooled electronics

Energy efficiency based control for a cooling system

Mechanically flexible cold plates for low power components

Chip package for two-phase cooling and assembly process thereof

System level model for pumped two-phase cooling systems

Counter-flow expanding channels for enhanced two-phase heat removal

Patents Applicationslast 30 patents

PROCESSOR MODULE INSTALLATION TOOL WITH PROTECTIVE INTERLOCK FEATURE

COLD PLATE WITH UNIFORM PLENUM FLOW

COMPLIANT COUNTER-FLOW COLD PLATE

REDUCED PRESSURE DROP COLD PLATE TRANSITION

WAFER TO WAFER HIGH DENSITY INTERCONNECTS

INTEGRATED CIRCUIT CHIP HAVING BACK-SURFACE TOPOGRAPHY FOR ENHANCED...

ROTATING LID FOR MODULE COOLER

TEMPORARY REMOVABLE MODULE LID

CO-PACKAGED OPTICAL MODULE

COLD PLATE WITH UNIFORM PLENUM FLOW

REDUCED PRESSURE DROP COLD PLATE TRANSITION

WAFER SCALE SUPERCOMPUTER

DATA CENTER COOLANT SWITCH

PATTERN BONDED FINNED COLD PLATE

ENERGY EFFICIENCY BASED CONTROL FOR A COOLING SYSTEM

MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS

THERMAL INTERFACE FORMED BY CONDENSATE

SYSTEM LEVEL MODEL FOR PUMPED TWO-PHASE COOLING SYSTEMS

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

VARIABLE PIN FIN CONSTRUCTION TO FACILITATE COMPLIANT COLD PLATES

DATA CENTER COOLANT SWITCH

Module Lid with Embedded Two-Phase Cooling and Insulating Layer

TWO-PHASE LIQUID COOLED ELECTRONICS

CONDUCTIVE HEAT SPREADER AND HEAT SINK ASSEMBLY FOR OPTICAL DEVICES

MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS

BURST RESISTANT THIN WALL HEAT SINK

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...

HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS

WAFER LEVEL INTEGRATION FOR EMBEDDED COOLING