Mark Daniel Derwin

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Binghamton, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a multi-layered circuitized substrate member
- Patent number 5,827,386
- Issue date Oct 27, 1998
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with material containment means and method of...
- Patent number 5,731,547
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Mark Daniel Derwin
- H01 - BASIC ELECTRIC ELEMENTS