Mark Drucker

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Poway, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit assembly and method of making
- Patent number 9,412,644
- Issue date Aug 9, 2016
- QUALCOMM Incorporated
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin integrated circuit chip-on-board assembly
- Patent number 9,368,468
- Issue date Jun 14, 2016
- QUALCOMM SWITCH CORP.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin integrated circuit chip-on-board assembly and method of making
- Patent number 8,921,168
- Issue date Dec 30, 2014
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly and method of making
- Patent number 8,912,646
- Issue date Dec 16, 2014
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Assembly and Method of Making
- Publication number 20160284671
- Publication date Sep 29, 2016
- QUALCOMM SWITCH CORP.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING
- Publication number 20150140782
- Publication date May 21, 2015
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING
- Publication number 20150108640
- Publication date Apr 23, 2015
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Contacting First Wafer through Second Wafer
- Publication number 20140319698
- Publication date Oct 30, 2014
- Stuart B. Molin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING
- Publication number 20140035129
- Publication date Feb 6, 2014
- IO SEMICONDUCTOR, INC.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING
- Publication number 20130134585
- Publication date May 30, 2013
- IO SEMICONDUCTOR, INC.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS