Mark E. Schlarmann

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress isolated device package and method of manufacture
- Patent number 12,012,328
- Issue date Jun 18, 2024
- NXP USA, INC.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,760,623
- Issue date Sep 19, 2023
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,498,829
- Issue date Nov 15, 2022
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor having sense elements in multiple wheatstone bridge...
- Patent number 10,260,981
- Issue date Apr 16, 2019
- NXP USA, INC.
- Paige M. Holm
- G01 - MEASURING TESTING
Information Patent Grant
Multi-chip device with temperature control element for temperature...
- Patent number 9,927,266
- Issue date Mar 27, 2018
- NXP USA, INC.
- Chad S. Dawson
- G01 - MEASURING TESTING
Information Patent Grant
Devices and methods for testing integrated circuit devices
- Patent number 9,818,656
- Issue date Nov 14, 2017
- NXP USA, INC.
- Mark Edward Schlarmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for monitoring an accelerometer
- Patent number 9,297,826
- Issue date Mar 29, 2016
- Freescale Semiconductor Inc.
- Deyou Fang
- G01 - MEASURING TESTING
Information Patent Grant
Tester and method for testing a strip of devices
- Patent number 9,285,422
- Issue date Mar 15, 2016
- Freescale Semiconductor Inc.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stiction resistant mems device and method of operation
- Patent number 9,190,937
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electro-mechanical oscillator and common-mode detection circuit
- Patent number 9,157,945
- Issue date Oct 13, 2015
- Freescale Semiconductor Inc.
- Keith L. Kraver
- G01 - MEASURING TESTING
Information Patent Grant
MEMS device assembly and method of packaging same
- Patent number 9,131,325
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for improved MEMS oscillator startup
- Patent number 9,118,334
- Issue date Aug 25, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectromechanical system package and method of testing
- Patent number 9,116,165
- Issue date Aug 25, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- G01 - MEASURING TESTING
Information Patent Grant
System and method for monitoring a gyroscope
- Patent number 9,109,901
- Issue date Aug 18, 2015
- Freescale Semiconductor Inc.
- Deyou Fang
- G01 - MEASURING TESTING
Information Patent Grant
System and method for reducing offset variation in multifunction se...
- Patent number 9,103,845
- Issue date Aug 11, 2015
- Freescale Semiconductor Inc.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure transducer assembly
- Patent number 9,090,455
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure transducer assembly and method of packaging same
- Patent number 8,889,451
- Issue date Nov 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor device with multi-stimulus sensing
- Patent number 8,487,387
- Issue date Jul 16, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor device and method of fabricating same
- Patent number 8,316,718
- Issue date Nov 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device assembly and method of packaging same
- Patent number 8,304,275
- Issue date Nov 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing a microelectromechanical (MEMS) sensor device
- Patent number 8,216,882
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically alterable circuit for use in an integrated circuit device
- Patent number 8,178,942
- Issue date May 15, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20230059566
- Publication date Feb 23, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220348456
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20210221671
- Publication date Jul 22, 2021
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR HAVING SENSE ELEMENTS IN MULTIPLE WHEATSTONE BRIDGE...
- Publication number 20180224348
- Publication date Aug 9, 2018
- NXP USA, Inc.
- Paige M. Holm
- G01 - MEASURING TESTING
Information Patent Application
MEMS SENSOR DEVICE HAVING INTEGRATED MULTIPLE STIMULUS SENSING
- Publication number 20170115322
- Publication date Apr 27, 2017
- FREESCALE SEMICONDUCTOR, INC.
- FENGYUAN LI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRO-MECHANICAL OSCILLATOR AND COMMON-MODE DETECTION CIRCUIT
- Publication number 20150061702
- Publication date Mar 5, 2015
- KEITH L. KRAVER
- G01 - MEASURING TESTING
Information Patent Application
MULTI-CHIP DEVICE WITH TEMPERATURE CONTROL ELEMENT FOR TEMPERATURE...
- Publication number 20140376586
- Publication date Dec 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chad S. Dawson
- G01 - MEASURING TESTING
Information Patent Application
MEMS PRESSURE TRANSDUCER ASSEMBLY
- Publication number 20140339656
- Publication date Nov 20, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR IMPROVED MEMS OSCILLATOR STARTUP
- Publication number 20140266474
- Publication date Sep 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEM AND METHOD FOR MONITORING AN ACCELEROMETER
- Publication number 20140250971
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Deyou FANG
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR REDUCING OFFSET VARIATION IN MULTIFUNCTION SE...
- Publication number 20140251009
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. SCHLARMANN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR MONITORING A GYROSCOPE
- Publication number 20140250970
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Deyou FANG
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE
- Publication number 20140225206
- Publication date Aug 14, 2014
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STICTION RESISTANT MEMS DEVICE AND METHOD OF OPERATION
- Publication number 20140217929
- Publication date Aug 7, 2014
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TESTER AND METHOD FOR TESTING A STRIP OF DEVICES
- Publication number 20130297248
- Publication date Nov 7, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chad S. Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM PACKAGE AND METHOD OF TESTING
- Publication number 20130257445
- Publication date Oct 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- G01 - MEASURING TESTING
Information Patent Application
MEMS PRESSURE TRANSDUCER ASSEMBLY AND METHOD OF PACKAGING SAME
- Publication number 20130214365
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING
- Publication number 20120256282
- Publication date Oct 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME
- Publication number 20120175747
- Publication date Jul 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME
- Publication number 20120049298
- Publication date Mar 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabric...
- Publication number 20120043627
- Publication date Feb 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Pressure Sensor Device and Method of Fabricating Same
- Publication number 20120042731
- Publication date Feb 23, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICALLY ALTERABLE CIRCUIT FOR USE IN AN INTEGRATED CIRCUIT DEVICE
- Publication number 20100252908
- Publication date Oct 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- H01 - BASIC ELECTRIC ELEMENTS

Mark E. Schlarmann

Person

Patents Grantslast 30 patents

Stress isolated device package and method of manufacture

No-gel pressure sensor package

No-gel pressure sensor package

Pressure sensor having sense elements in multiple wheatstone bridge...

Multi-chip device with temperature control element for temperature...

Devices and methods for testing integrated circuit devices

System and method for monitoring an accelerometer

Tester and method for testing a strip of devices

Stiction resistant mems device and method of operation

Electro-mechanical oscillator and common-mode detection circuit

MEMS device assembly and method of packaging same

System and method for improved MEMS oscillator startup

Microelectromechanical system package and method of testing

System and method for monitoring a gyroscope

System and method for reducing offset variation in multifunction se...

MEMS pressure transducer assembly

MEMS pressure transducer assembly and method of packaging same

MEMS sensor device with multi-stimulus sensing

MEMS pressure sensor device and method of fabricating same

MEMS device assembly and method of packaging same

Method of producing a microelectromechanical (MEMS) sensor device

Electrically alterable circuit for use in an integrated circuit device

Patents Applicationslast 30 patents

NO-GEL PRESSURE SENSOR PACKAGE

STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE

NO-GEL PRESSURE SENSOR PACKAGE

PRESSURE SENSOR HAVING SENSE ELEMENTS IN MULTIPLE WHEATSTONE BRIDGE...

MEMS SENSOR DEVICE HAVING INTEGRATED MULTIPLE STIMULUS SENSING

ELECTRO-MECHANICAL OSCILLATOR AND COMMON-MODE DETECTION CIRCUIT

MULTI-CHIP DEVICE WITH TEMPERATURE CONTROL ELEMENT FOR TEMPERATURE...

MEMS PRESSURE TRANSDUCER ASSEMBLY

SYSTEM AND METHOD FOR IMPROVED MEMS OSCILLATOR STARTUP

SYSTEM AND METHOD FOR MONITORING AN ACCELEROMETER

SYSTEM AND METHOD FOR REDUCING OFFSET VARIATION IN MULTIFUNCTION SE...

SYSTEM AND METHOD FOR MONITORING A GYROSCOPE

PRESSURE LEVEL ADJUSTMENT IN A CAVITY OF A SEMICONDUCTOR DIE

STICTION RESISTANT MEMS DEVICE AND METHOD OF OPERATION

TESTER AND METHOD FOR TESTING A STRIP OF DEVICES

MICROELECTROMECHANICAL SYSTEM PACKAGE AND METHOD OF TESTING

MEMS PRESSURE TRANSDUCER ASSEMBLY AND METHOD OF PACKAGING SAME

MEMS SENSOR DEVICE WITH MULTI-STIMULUS SENSING

MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME

MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME

MEMS Sensor Device With Multi-Stimulus Sensing and Method of Fabric...

MEMS Pressure Sensor Device and Method of Fabricating Same

ELECTRICALLY ALTERABLE CIRCUIT FOR USE IN AN INTEGRATED CIRCUIT DEVICE