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Mark E. Thurston
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Chandler, AZ, US
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last 30 patents
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Patent Grant
Package substrate for integrated circuit and method of making the s...
Patent number
7,152,313
Issue date
Dec 26, 2006
Intel Corporation
Dustin P. Wood
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Package substrate for integrated circuit and method of making the s...
Publication number
20050111207
Publication date
May 26, 2005
Dustin P. Wood
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR