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Mark E. Webster
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Kokomo, IN, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for wire bonding an aluminum wire to a lead of an electronic...
Patent number
5,492,263
Issue date
Feb 20, 1996
Delco Electronics Corp.
Mark E. Webster
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Wirebond pin-plastic header combination and methods of making and u...
Patent number
5,263,880
Issue date
Nov 23, 1993
Delco Electronics Corporation
Dwight L. Schwarz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Method for forming BGA package with increased standoff height
Publication number
20090080169
Publication date
Mar 26, 2009
Mark E. Webster
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...