Mark EBLEN

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Temecula, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic feedthrough assemblies for electronic devices with metal ho...
- Patent number 11,424,053
- Issue date Aug 23, 2022
- Kyocera International, Inc.
- Franklin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead package and method for minimizing deflection in microelectroni...
- Patent number 10,410,959
- Issue date Sep 10, 2019
- Kyocera International, Inc.
- Franklin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and package having stress release...
- Patent number 9,859,185
- Issue date Jan 2, 2018
- Kyocera International, Inc.
- Satoru Tomie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat management in electronics packaging
- Patent number 9,331,000
- Issue date May 3, 2016
- Kyocera America, Inc.
- Mark Eblen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE CONSTRUCTION ENABLED THROUGH CERAMIC INSULA...
- Publication number 20190006254
- Publication date Jan 3, 2019
- Kyocera International, Inc.
- Mark EBLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD PACKAGE AND METHOD FOR MINIMIZING DEFLECTION IN MICROELECTRONI...
- Publication number 20180374781
- Publication date Dec 27, 2018
- Kyocera International, Inc.
- Franklin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGE HAVING STRESS RELEASE...
- Publication number 20170221790
- Publication date Aug 3, 2017
- Kyocera International, Inc.
- Satoru TOMIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT MANAGEMENT IN ELECTRONICS PACKAGING
- Publication number 20150287661
- Publication date Oct 8, 2015
- Kyocera America Inc
- Mark EBLEN
- H01 - BASIC ELECTRIC ELEMENTS