Mark GERBER

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,862,587
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Mark Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a reinforcement structure on...
- Patent number 11,342,282
- Issue date May 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220359425
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265280
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsu-Chiang SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210028134
- Publication date Jan 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Mark GERBER
- H01 - BASIC ELECTRIC ELEMENTS