Mark J. Kuzawinski

Person

Maine, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with overlapping bond fingers
- Patent number 6,956,286
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Mark J. Kuzawinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,946,746
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating tail design for IC packages
- Patent number 6,908,855
- Issue date Jun 21, 2005
- International Business Machines Corporation
- Mark J. Kuzawinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating tail design for IC packages
- Patent number 6,882,038
- Issue date Apr 19, 2005
- International Business Machines Corporation
- Mark J. Kuzawinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,737,296
- Issue date May 18, 2004
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,414,386
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing a remotely located outrigger car...
- Patent number 5,872,935
- Issue date Feb 16, 1999
- International Business Machines Corporation
- Mark Budman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for providing a remotely located outrigger car...
- Patent number 5,649,121
- Issue date Jul 15, 1997
- International Business Machines Corporation
- Mark Budman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flex circuit electronic cards
- Patent number 5,276,590
- Issue date Jan 4, 1994
- International Business Machines Corporation
- Mark Budman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power controller for permitting multiple processors to power up sha...
- Patent number 5,251,320
- Issue date Oct 5, 1993
- International Business Machines Corporation
- Mark J. Kuzawinski
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Plating tail design for IC packages
- Publication number 20050051879
- Publication date Mar 10, 2005
- International Business Machines Corporation
- Mark J. Kuzawinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package with overlapping bond fingers
- Publication number 20050029649
- Publication date Feb 10, 2005
- Mark J. Kuzawinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce number of wire-bond loop heights versus the total...
- Publication number 20040173893
- Publication date Sep 9, 2004
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating tail design for IC packages
- Publication number 20040104464
- Publication date Jun 3, 2004
- International Business Machines Corporation
- Mark J. Kuzawinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method to reduce number of wire-bond loop heights versus the total...
- Publication number 20020145193
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS

Mark J. Kuzawinski

Person

Patents Grantslast 30 patents

Integrated circuit package with overlapping bond fingers

Method to reduce number of wire-bond loop heights versus the total...

Plating tail design for IC packages

Plating tail design for IC packages

Method to reduce number of wire-bond loop heights versus the total...

Method to reduce number of wire-bond loop heights versus the total...

Method and apparatus for providing a remotely located outrigger car...

Method and apparatus for providing a remotely located outrigger car...

Flex circuit electronic cards

Power controller for permitting multiple processors to power up sha...

Patents Applicationslast 30 patents

Plating tail design for IC packages

Integrated circuit package with overlapping bond fingers

Method to reduce number of wire-bond loop heights versus the total...

Plating tail design for IC packages

Method to reduce number of wire-bond loop heights versus the total...