Mark L. Janecek

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Endicott, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for making multi-layer printed circuit board registration
- Patent number 6,662,441
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Mark L. Janecek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,576,549
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a metalized blind via
- Patent number 6,522,014
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board registration
- Patent number 6,232,559
- Issue date May 15, 2001
- International Business Machines Corporation
- Mark L. Janecek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Fabrication of a metalized blind via
- Publication number 20030054635
- Publication date Mar 20, 2003
- Frank D. Egitto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board construction
- Publication number 20020166697
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Mark L. Janecek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Multi-layer printed circuit board registration
- Publication number 20010030058
- Publication date Oct 18, 2001
- International Business Machines Corporation
- Mark L. Janecek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC