Mark Lamb

Follow

Person

Goleta, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,969,610
- Issue date May 15, 2018
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,771,258
- Issue date Sep 26, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20170129775
- Publication date May 11, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20160376146
- Publication date Dec 29, 2016
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY