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Mark Lefebvre

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Patents Grantslast 30 patents

  • Information Patent Grant

    Indium electroplating compositions containing amine compounds and m...
    • Patent number 10,428,436
    • Issue date Oct 1, 2019
    • Rohm and Haas Electronic Materials LLC
    • Yi Qin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of electroplating photoresist defined features from copper e...
    • Patent number 10,104,782
    • Issue date Oct 16, 2018
    • Dow Global Technologies LLC
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of electroplating photoresist defined features from copper e...
    • Patent number 10,100,421
    • Issue date Oct 16, 2018
    • Dow Global Technologies LLC
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of electroplating photoresist defined features from copper e...
    • Patent number 10,006,136
    • Issue date Jun 26, 2018
    • Dow Global Technologies LLC
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of electroplating photoresist defined features from copper e...
    • Patent number 9,932,684
    • Issue date Apr 3, 2018
    • Rohm and Haas Electronic Materials LLC
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Indium electroplating compositions containing 1,10-phenanthroline c...
    • Patent number 9,809,892
    • Issue date Nov 7, 2017
    • Rohm and Haas Electronic Materials LLC
    • Yi Qin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating method
    • Patent number 9,809,891
    • Issue date Nov 7, 2017
    • Rohm and Haas Electronic Materials LLC
    • Matthew A. Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of electroplating uniform copper layers
    • Patent number 9,365,943
    • Issue date Jun 14, 2016
    • Rohm and Haas Electronic Materials LLC
    • Elie H. Najjar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal plating compositions and methods
    • Patent number 8,956,523
    • Issue date Feb 17, 2015
    • Rohm and Haas Electronic Materials LLC
    • Erik Reddington
    • C07 - ORGANIC CHEMISTRY
  • Information Patent Grant

    Article having electrically conductive and selectively passivated p...
    • Patent number 8,716,824
    • Issue date May 6, 2014
    • Rohm and Haas Electronic Materials LLC
    • Jitendra S. Goela
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal plating compositions
    • Patent number 8,337,688
    • Issue date Dec 25, 2012
    • Rohm and Haas Electronic Materials LLC
    • Erik Reddington
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal plating compositions and methods
    • Patent number 8,329,018
    • Issue date Dec 11, 2012
    • Rohm and Haas Electronic Materials LLC
    • Erik Reddington
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Optical article
    • Patent number 8,198,120
    • Issue date Jun 12, 2012
    • Rohm and Haas Electronic Materials LLC
    • Jitendra S. Goela
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal plating compositions
    • Patent number 8,048,284
    • Issue date Nov 1, 2011
    • Rohm and Haas Electronic Materials LLC
    • Erik Reddington
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Metal plating compositions and methods
    • Patent number 8,012,334
    • Issue date Sep 6, 2011
    • Rohm and Haas Electronic Materials LLC
    • Erik Reddington
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Seed layer
    • Patent number 6,660,154
    • Issue date Dec 9, 2003
    • Shipley Company, L.L.C.
    • David Merricks
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Seed layer repair bath
    • Patent number 6,660,153
    • Issue date Dec 9, 2003
    • Shipley Company, L.L.C.
    • David Merricks
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Seed layer repair method
    • Patent number 6,531,046
    • Issue date Mar 11, 2003
    • Shipley Company, L.L.C.
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electrolytic copper plating method
    • Patent number 6,444,110
    • Issue date Sep 3, 2002
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    INDIUM ELECTROPLATING COMPOSITIONS CONTAINING AMINE COMPOUNDS AND M...
    • Publication number 20180016691
    • Publication date Jan 18, 2018
    • Rohm and Haas Electronic Materials L.L.C.
    • Yi Qin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING I...
    • Publication number 20180016689
    • Publication date Jan 18, 2018
    • Rohm and Haas Electronic Materials L.L.C.
    • Yi Qin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    INDIUM ELECTROPLATING COMPOSITIONS CONTAINING 2-IMIDAZOLIDINETHIONE...
    • Publication number 20180016690
    • Publication date Jan 18, 2018
    • Rohm and Haas Electronic Materials L.L.C.
    • Yi Qin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING LOW INTERNAL STRESS COPPER DEPOSITS ON THI...
    • Publication number 20170145577
    • Publication date May 25, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Yu Hua Kao
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW I...
    • Publication number 20170067173
    • Publication date Mar 9, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Lingyun Wei
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
    • Publication number 20170037526
    • Publication date Feb 9, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
    • Publication number 20170042037
    • Publication date Feb 9, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
    • Publication number 20170037527
    • Publication date Feb 9, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
    • Publication number 20170037528
    • Publication date Feb 9, 2017
    • Rohm and Haas Electronic Materials L.L.C.
    • Matthew Thorseth
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW I...
    • Publication number 20160312372
    • Publication date Oct 27, 2016
    • Rohm and Haas Electronic Materials L.L.C.
    • Lingyun WEI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD
    • Publication number 20150376807
    • Publication date Dec 31, 2015
    • Rohm and Haas Electronic Materials L.L.C.
    • Matthew A. THORSETH
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METAL PLATING COMPOSITIONS AND METHODS
    • Publication number 20140081045
    • Publication date Mar 20, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Erik Reddington
    • C07 - ORGANIC CHEMISTRY
  • Information Patent Application

    METHOD OF ELECTROPLATING UNIFORM COPPER LAYERS
    • Publication number 20120318676
    • Publication date Dec 20, 2012
    • Rohm and Haas Electronic Materials L.L.C.
    • Elie H. NAJJAR
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METAL PLATING COMPOSITIONS
    • Publication number 20120034371
    • Publication date Feb 9, 2012
    • Rohm and Haas Electronic Materials L.L.C.
    • Erik Reddington
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METAL PLATING COMPOSITIONS AND METHODS
    • Publication number 20110318479
    • Publication date Dec 29, 2011
    • Rohm and Haas Electronic Materials L.L.C.
    • Erik Reddington
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Optical article
    • Publication number 20100170707
    • Publication date Jul 8, 2010
    • Rohm and Haas Electronic Materials L.L.C.
    • Jitendra S. Goela
    • G02 - OPTICS
  • Information Patent Application

    Optical article
    • Publication number 20090186480
    • Publication date Jul 23, 2009
    • Rohm and Haas Electronic Materials L.L.C.
    • Jitendra S. Goela
    • G02 - OPTICS
  • Information Patent Application

    Metal plating compositions
    • Publication number 20080269395
    • Publication date Oct 30, 2008
    • Rohm and Haas Electronic Materials L.L.C.
    • Erik Reddington
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Metal plating compositions and methods
    • Publication number 20080268138
    • Publication date Oct 30, 2008
    • Rohm and Haas Electronic Materials L.L.C.
    • Erik Reddington
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060183328
    • Publication date Aug 17, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20060065537
    • Publication date Mar 30, 2006
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Optical article
    • Publication number 20050145968
    • Publication date Jul 7, 2005
    • Rohm and Haas Electronic Materials, L.L.C.
    • Jitendra S. Goela
    • G02 - OPTICS
  • Information Patent Application

    Process of producing printed circuit boards and the circuit boards...
    • Publication number 20040084399
    • Publication date May 6, 2004
    • Shipley Company, L.L.C.
    • Lee M. Cook
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electrolytic copper plating solutions
    • Publication number 20030010646
    • Publication date Jan 16, 2003
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer repair bath
    • Publication number 20020088713
    • Publication date Jul 11, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating bath
    • Publication number 20020090484
    • Publication date Jul 11, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Seed layer
    • Publication number 20020084193
    • Publication date Jul 4, 2002
    • Shipley Company, L.L.C.
    • David Merricks
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Seed layer repair method
    • Publication number 20020000382
    • Publication date Jan 3, 2002
    • Shipley Company, L.L.C. of Marlborough
    • Denis Morrissey
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROLYTIC COPPER PLATING SOLUTIONS
    • Publication number 20010047943
    • Publication date Dec 6, 2001
    • LEON BARSTAD
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR