Mark R. Schneider

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of assembling a heat sink assembly
- Patent number 5,963,795
- Issue date Oct 5, 1999
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable heatsink structures for semiconductor devices
- Patent number 5,900,670
- Issue date May 4, 1999
- LSI Logic Corporation
- Mark Schneider
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Technique for mounting a semiconductor die
- Patent number 5,888,847
- Issue date Mar 30, 1999
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array with inexpensive threaded secure locking mechanism...
- Patent number 5,885,848
- Issue date Mar 23, 1999
- LSI Logic Corporation
- Janet Kirkland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder metal heat sink for integrated circuit devices
- Patent number 5,869,778
- Issue date Feb 9, 1999
- LSI Logic Corporation
- Mark R. Schneider
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Powdered metal heat sink with increased surface area
- Patent number 5,869,891
- Issue date Feb 9, 1999
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing powdered metal heat sinks having increased...
- Patent number 5,814,536
- Issue date Sep 29, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with inexpensive threaded secure locking me...
- Patent number 5,789,813
- Issue date Aug 4, 1998
- LSI Logic Corporation
- Janet Kirkland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having fluid-filled and gas-filled thermal coolin...
- Patent number 5,780,928
- Issue date Jul 14, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System having stackable heat sink structures
- Patent number 5,773,886
- Issue date Jun 30, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for fabricating conductive epoxy grid array semiconductor pa...
- Patent number 5,744,171
- Issue date Apr 28, 1998
- LSI Logic Corporation
- Mark Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling ball bump grid array semiconductor packages
- Patent number 5,729,894
- Issue date Mar 24, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printable superconductive leadframes for semiconductor device assembly
- Patent number 5,728,599
- Issue date Mar 17, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with heat dissipating apparatus and method of dis...
- Patent number 5,693,981
- Issue date Dec 2, 1997
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable heatsink structure for semiconductor devices
- Patent number 5,654,587
- Issue date Aug 5, 1997
- LSI Logic Corporation
- Mark Schneider
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for protecting a semiconductor device with a superconductive...
- Patent number 5,644,143
- Issue date Jul 1, 1997
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic integrated circuit mounted on circuit board with so...
- Patent number 5,639,696
- Issue date Jun 17, 1997
- LSI Logic Corporation
- Dexin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package fabrication method and apparatus
- Patent number 5,610,442
- Issue date Mar 11, 1997
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming superconductive lines
- Patent number 5,593,918
- Issue date Jan 14, 1997
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive epoxy grid array semiconductor packages
- Patent number 5,572,069
- Issue date Nov 5, 1996
- LSI Logic Corporation
- Mark Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dissipating heat in an electronic device
- Patent number 5,552,634
- Issue date Sep 3, 1996
- LSI Logic Corporation
- Mark R. Schneider
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Powder metal heat sink for integrated circuit devices
- Patent number 5,514,327
- Issue date May 7, 1996
- LSI Logic Corporation
- Mark R. Schneider
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Microcircuit package assembly utilizing large size die and low temp...
- Patent number 5,504,374
- Issue date Apr 2, 1996
- LSI Logic Corporation
- Susan A. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive epoxy grid array semiconductors p...
- Patent number 5,410,806
- Issue date May 2, 1995
- LSI Logic Corporation
- Mark Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-filled and gas-filled semiconductor packages
- Patent number 5,405,808
- Issue date Apr 11, 1995
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for semiconductor device assembly
- Patent number 5,311,060
- Issue date May 10, 1994
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for semiconductor device assembly
- Patent number 5,175,612
- Issue date Dec 29, 1992
- LSI Logic Corporation
- Jon Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for board-mounted semiconductor devices and semiconductor...
- Patent number 5,172,301
- Issue date Dec 15, 1992
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a plastic-packaged semiconductor device having lea...
- Patent number 5,104,827
- Issue date Apr 14, 1992
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic-packaged semiconductor device having lead support and align...
- Patent number 5,051,813
- Issue date Sep 24, 1991
- LSI Logic Corporation
- Mark R. Schneider
- H01 - BASIC ELECTRIC ELEMENTS

Mark R. Schneider

Person

Patents Grantslast 30 patents

Method of assembling a heat sink assembly

Stackable heatsink structures for semiconductor devices

Technique for mounting a semiconductor die

Ball grid array with inexpensive threaded secure locking mechanism...

Powder metal heat sink for integrated circuit devices

Powdered metal heat sink with increased surface area

Method of manufacturing powdered metal heat sinks having increased...

Ball grid array package with inexpensive threaded secure locking me...

Electronic system having fluid-filled and gas-filled thermal coolin...

System having stackable heat sink structures

System for fabricating conductive epoxy grid array semiconductor pa...

Method of assembling ball bump grid array semiconductor packages

Printable superconductive leadframes for semiconductor device assembly

Electronic system with heat dissipating apparatus and method of dis...

Stackable heatsink structure for semiconductor devices

Method for protecting a semiconductor device with a superconductive...

Microelectronic integrated circuit mounted on circuit board with so...

Semiconductor device package fabrication method and apparatus

Techniques for forming superconductive lines

Conductive epoxy grid array semiconductor packages

Method and apparatus for dissipating heat in an electronic device

Powder metal heat sink for integrated circuit devices

Microcircuit package assembly utilizing large size die and low temp...

Method for fabricating conductive epoxy grid array semiconductors p...

Fluid-filled and gas-filled semiconductor packages

Heat sink for semiconductor device assembly

Heat sink for semiconductor device assembly

Heatsink for board-mounted semiconductor devices and semiconductor...

Method of making a plastic-packaged semiconductor device having lea...

Plastic-packaged semiconductor device having lead support and align...