Mark Raffetto

Person

Santa Barbara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,759,868
- Issue date Jun 24, 2014
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,686,460
- Issue date Apr 1, 2014
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,089,090
- Issue date Jan 3, 2012
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin ohmic contacts for p-type nitride light emitting devices
- Patent number 8,044,425
- Issue date Oct 25, 2011
- Cree, Inc.
- Mark Raffetto
Information Patent Grant
Light emitting devices suitable for flip-chip bonding
- Patent number 7,608,860
- Issue date Oct 27, 2009
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of light emitting diodes having shaped substrates
- Patent number 7,341,175
- Issue date Mar 11, 2008
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding of light emitting devices
- Patent number 7,259,033
- Issue date Aug 21, 2007
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding of light emitting devices and light emitting devi...
- Patent number 6,888,167
- Issue date May 3, 2005
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collets for bonding of light emitting diodes having shaped substrates
- Patent number 6,747,298
- Issue date Jun 8, 2004
- Cree, Inc.
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN OHMIC CONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES
- Publication number 20120080688
- Publication date Apr 5, 2012
- Cree, Inc.
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING
- Publication number 20070241360
- Publication date Oct 18, 2007
- Cree, Inc.
- David B. Slater, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin ohmic contacts for p-type nitride light emitting devices...
- Publication number 20060046328
- Publication date Mar 2, 2006
- Mark Raffetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES
- Publication number 20040200882
- Publication date Oct 14, 2004
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding of light emitting diodes having shaped substrates and colle...
- Publication number 20030042507
- Publication date Mar 6, 2003
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip bonding of light emitting devices and light emitting devi...
- Publication number 20030045015
- Publication date Mar 6, 2003
- David B. Slater
- H01 - BASIC ELECTRIC ELEMENTS

Mark Raffetto

Person

Patents Grantslast 30 patents

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Light emitting devices suitable for flip-chip bonding

Bonding of light emitting diodes having shaped substrates

Flip-chip bonding of light emitting devices

Flip-chip bonding of light emitting devices and light emitting devi...

Collets for bonding of light emitting diodes having shaped substrates

Patents Applicationslast 30 patents

ULTRA-THIN OHMIC CONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES

LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING

Ultra-thin ohmic contacts for p-type nitride light emitting devices...

BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES

Bonding of light emitting diodes having shaped substrates and colle...

Flip-chip bonding of light emitting devices and light emitting devi...