Mark Scalisi

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Salem, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of electroplating copper into a via on a substrate from an a...
- Patent number 10,988,852
- Issue date Apr 27, 2021
- Rohm and Haas Electronic Materials LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,508,349
- Issue date Dec 17, 2019
- Rohm and Haas Electronic Materials LLC
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electroplating baths and electroplating methods capable of e...
- Patent number 10,190,228
- Issue date Jan 29, 2019
- Rohm and Haas Electronic Materials LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method
- Patent number 9,809,891
- Issue date Nov 7, 2017
- Rohm and Haas Electronic Materials LLC
- Matthew A. Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170370014
- Publication date Dec 28, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Ravi Pokhrel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF E...
- Publication number 20170283970
- Publication date Oct 5, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN A...
- Publication number 20170114469
- Publication date Apr 27, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD
- Publication number 20150376807
- Publication date Dec 31, 2015
- Rohm and Haas Electronic Materials L.L.C.
- Matthew A. THORSETH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR