Mark Shane Peng

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Networking packages based on interposers
- Patent number 9,686,865
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with distributed power supply comprising...
- Patent number 9,406,597
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for increasing bandwidths of stacked dies
- Patent number 9,177,892
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Networking packages based on interposers
- Patent number 9,064,715
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for increasing bandwidths of stacked dies
- Patent number 8,952,548
- Issue date Feb 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable semiconductor interposer for electronic package and me...
- Patent number 8,945,998
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with distributed power supply comprising...
- Patent number 8,716,855
- Issue date May 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable semiconductor interposer for electronic package and me...
- Patent number 8,476,735
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing voltage drops in power networks using unused spaces in int...
- Patent number 8,276,110
- Issue date Sep 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dinesh Baviskar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clocking architecture in stacked and bonded dice
- Patent number 7,989,226
- Issue date Aug 2, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clocking architecture in stacked and bonded dice
- Patent number 7,859,117
- Issue date Dec 28, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV-enabled twisted pair
- Patent number 7,812,426
- Issue date Oct 12, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming single dies with multi-layer interconnect struc...
- Patent number 7,795,735
- Issue date Sep 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiP (system in package) design systems and methods
- Patent number 7,565,635
- Issue date Jul 21, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,514,775
- Issue date Apr 7, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design techniques for stacking identical memory dies
- Patent number 7,494,846
- Issue date Feb 24, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Electromagnetic shielding using through-silicon vias
- Patent number 7,427,803
- Issue date Sep 23, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Networking Packages Based on Interposers
- Publication number 20150289376
- Publication date Oct 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and Method for Increasing Bandwidths of Stacked Dies
- Publication number 20150145147
- Publication date May 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY
- Publication number 20140210077
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Semiconductor Interposer for Electronic Package and Me...
- Publication number 20130295727
- Publication date Nov 7, 2013
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Increasing Bandwidths of Stacked Dies
- Publication number 20120250286
- Publication date Oct 4, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bandgap Reference Apparatus and Methods
- Publication number 20120176186
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Chen
- G05 - CONTROLLING REGULATING
Information Patent Application
Networking Packages Based on Interposers
- Publication number 20120147567
- Publication date Jun 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Han LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY
- Publication number 20120112352
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-An CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Voltage Drops in Power Networks Using Unused Spaces in Int...
- Publication number 20110185331
- Publication date Jul 28, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dinesh Baviskar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Clocking Architecture in Stacked and Bonded Dice
- Publication number 20110102044
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-Enabled Twisted Pair
- Publication number 20090294915
- Publication date Dec 3, 2009
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable semiconductor interposer for electronic package and me...
- Publication number 20080296697
- Publication date Dec 4, 2008
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS
- Publication number 20080250182
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...
- Publication number 20080233710
- Publication date Sep 25, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design techniques for stacking identical memory dies
- Publication number 20080220565
- Publication date Sep 11, 2008
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
Clocking architecture in stacked and bonded dice
- Publication number 20080204104
- Publication date Aug 28, 2008
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20080083975
- Publication date Apr 10, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic shielding using through-silicon vias
- Publication number 20080073747
- Publication date Mar 27, 2008
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test probe for integrated circuits with ultra-fine pitch terminals
- Publication number 20080018350
- Publication date Jan 24, 2008
- Clinton Chao
- G01 - MEASURING TESTING

Mark Shane Peng

Person

Patents Grantslast 30 patents

Networking packages based on interposers

Integrated circuit system with distributed power supply comprising...

Apparatus and method for increasing bandwidths of stacked dies

Networking packages based on interposers

Apparatus and method for increasing bandwidths of stacked dies

Programmable semiconductor interposer for electronic package and me...

Integrated circuit system with distributed power supply comprising...

Programmable semiconductor interposer for electronic package and me...

Reducing voltage drops in power networks using unused spaces in int...

Clocking architecture in stacked and bonded dice

Clocking architecture in stacked and bonded dice

TSV-enabled twisted pair

Methods for forming single dies with multi-layer interconnect struc...

SiP (system in package) design systems and methods

Stacked structures and methods of fabricating stacked structures

Design techniques for stacking identical memory dies

Electromagnetic shielding using through-silicon vias

Patents Applicationslast 30 patents

Networking Packages Based on Interposers

Apparatus and Method for Increasing Bandwidths of Stacked Dies

INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY

Programmable Semiconductor Interposer for Electronic Package and Me...

Apparatus and Method for Increasing Bandwidths of Stacked Dies

Bandgap Reference Apparatus and Methods

Networking Packages Based on Interposers

INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY

Reducing Voltage Drops in Power Networks Using Unused Spaces in Int...

Clocking Architecture in Stacked and Bonded Dice

TSV-Enabled Twisted Pair

Programmable semiconductor interposer for electronic package and me...

SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS

METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...

Design techniques for stacking identical memory dies

Clocking architecture in stacked and bonded dice

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

Electromagnetic shielding using through-silicon vias

Test probe for integrated circuits with ultra-fine pitch terminals