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Patents Grants
last 30 patents
Information
Patent Grant
Hyperchip
Patent number
11,984,430
Issue date
May 14, 2024
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on active silicon semiconductor packages
Patent number
11,978,727
Issue date
May 7, 2024
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned contacts
Patent number
11,887,891
Issue date
Jan 30, 2024
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device layer interconnects
Patent number
11,881,452
Issue date
Jan 23, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, system and method for providing inductor structures
Patent number
11,830,829
Issue date
Nov 28, 2023
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hyperchip
Patent number
11,824,041
Issue date
Nov 21, 2023
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, method and system for providing a stacked arrangement of in...
Patent number
11,749,663
Issue date
Sep 5, 2023
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Uniform layouts for SRAM and register file bit cells
Patent number
11,737,253
Issue date
Aug 22, 2023
Intel Corporation
Zheng Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die interconnection scheme for providing a high yielding process fo...
Patent number
11,652,060
Issue date
May 16, 2023
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-less FinFET diode architectures with backside metal conta...
Patent number
11,652,107
Issue date
May 16, 2023
Intel Corporation
Nicholas Thomson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device with back-side interconnection to deep so...
Patent number
11,616,015
Issue date
Mar 28, 2023
Intel Corporation
Patrick Morrow
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Self-aligned contacts
Patent number
11,600,524
Issue date
Mar 7, 2023
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned gate edge and local interconnect
Patent number
11,563,081
Issue date
Jan 24, 2023
Daedalus Prime LLC
Milton Clair Webb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate-all-around integrated circuit structures having source or drai...
Patent number
11,522,048
Issue date
Dec 6, 2022
Intel Corporation
Cory Bomberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures having asymmetric source and drain st...
Patent number
11,462,536
Issue date
Oct 4, 2022
Intel Corporation
Anupama Bowonder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having tipless epitaxial source/drain regions
Patent number
11,437,514
Issue date
Sep 6, 2022
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device layer interconnects
Patent number
11,410,928
Issue date
Aug 9, 2022
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, system and method for providing inductor structures
Patent number
11,387,198
Issue date
Jul 12, 2022
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deep trench via for three-dimensional integrated circuit
Patent number
11,373,999
Issue date
Jun 28, 2022
Intel Corporation
Yih Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, method and system for providing a stacked arrangement of in...
Patent number
11,373,987
Issue date
Jun 28, 2022
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi version library cell handling and integrated circuit structur...
Patent number
11,271,010
Issue date
Mar 8, 2022
Intel Corporation
Ranjith Kumar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Distributed semiconductor die and package architecture
Patent number
11,257,804
Issue date
Feb 22, 2022
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density and fine pitch interconnect structures in an electric...
Patent number
11,249,113
Issue date
Feb 15, 2022
Intel Corporation
Pooya Tadayon
G01 - MEASURING TESTING
Information
Patent Grant
Techniques for die stacking and associated configurations
Patent number
11,222,863
Issue date
Jan 11, 2022
Intel Corporation
Fay Hua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Designs and methods for conductive bumps
Patent number
11,201,129
Issue date
Dec 14, 2021
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device with crenellated metal trace layout
Patent number
11,139,241
Issue date
Oct 5, 2021
Intel Corporation
Patrick Morrow
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Functionally redundant semiconductor dies and package
Patent number
11,127,712
Issue date
Sep 21, 2021
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power shared cell architecture
Patent number
11,068,640
Issue date
Jul 20, 2021
Intel Corporation
Ranjith Kumar
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multiple reticle field semiconductor devices
Patent number
11,043,459
Issue date
Jun 22, 2021
Intel Corporation
Edward A. Burton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through gate fin isolation
Patent number
11,037,923
Issue date
Jun 15, 2021
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20240096791
Publication date
Mar 21, 2024
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPERCHIP
Publication number
20240038722
Publication date
Feb 1, 2024
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED CONTACTS
Publication number
20240030067
Publication date
Jan 25, 2024
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIFORM LAYOUTS FOR SRAM AND REGISTER FILE BIT CELLS
Publication number
20230328947
Publication date
Oct 12, 2023
Intel Corporation
Zheng GUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REPLACEMENT METAL GATES TO ENHANCE TRANSISTOR STRAIN
Publication number
20230307455
Publication date
Sep 28, 2023
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FO...
Publication number
20230245974
Publication date
Aug 3, 2023
Intel Corporation
Wilfred GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPERCHIP
Publication number
20230238357
Publication date
Jul 27, 2023
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED GATE EDGE AND LOCAL INTERCONNECT
Publication number
20230178594
Publication date
Jun 8, 2023
Milton Clair Webb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED CONTACTS
Publication number
20230154793
Publication date
May 18, 2023
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAI...
Publication number
20230058558
Publication date
Feb 23, 2023
Intel Corporation
Cory BOMBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING TIPLESS EPITAXIAL SOURCE/DRAIN REGIONS
Publication number
20220359753
Publication date
Nov 10, 2022
Intel Corporation
Mark T. Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE LAYER INTERCONNECTS
Publication number
20220319978
Publication date
Oct 6, 2022
Intel Corporation
Mark Bohr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
Publication number
20220302051
Publication date
Sep 22, 2022
Intel Corporation
Wilfred GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
Publication number
20220285342
Publication date
Sep 8, 2022
Intel Corporation
Yih WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD AND SYSTEM FOR PROVIDING A STACKED ARRANGEMENT OF IN...
Publication number
20220271022
Publication date
Aug 25, 2022
Intel Corporation
Wilfred GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI VERSION LIBRARY CELL HANDLING AND INTEGRATED CIRCUIT STRUCTUR...
Publication number
20220149075
Publication date
May 12, 2022
Intel Corporation
Ranjith KUMAR
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
Publication number
20220139896
Publication date
May 5, 2022
Intel Corporation
WILFRED GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER-FILLED TRENCH CONTACT FOR TRANSISTOR PERFORMANCE IMPROVEMENT
Publication number
20220115505
Publication date
Apr 14, 2022
Intel Corporation
KELIN J. KUHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
Publication number
20220059484
Publication date
Feb 24, 2022
Intel Corporation
Valery M. DUBIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE WITH CRENELLATED METAL TRACE LAYOUT
Publication number
20220028779
Publication date
Jan 27, 2022
Intel Corporation
Patrick Morrow
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FUNCTIONALLY REDUNDANT SEMICONDUCTOR DIES AND PACKAGE
Publication number
20210375825
Publication date
Dec 2, 2021
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH GATE FIN ISOLATION
Publication number
20210233908
Publication date
Jul 29, 2021
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPERCHIP
Publication number
20210225808
Publication date
Jul 22, 2021
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
Publication number
20210210385
Publication date
Jul 8, 2021
Intel Corporation
Abhijit Jayant PETHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS
Publication number
20210193613
Publication date
Jun 24, 2021
Intel Corporation
Fay HUA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED CONTACTS
Publication number
20210134673
Publication date
May 6, 2021
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE WITH BACK-SIDE INERCONNECTION TO DEEP SOU...
Publication number
20210111115
Publication date
Apr 15, 2021
Intel Corporation
Patrick Morrow
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC...
Publication number
20210088554
Publication date
Mar 25, 2021
Intel Corporation
Pooya Tadayon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE, METHOD AND SYSTEM FOR PROVIDING A STACKED ARRANGEMENT OF IN...
Publication number
20210074695
Publication date
Mar 11, 2021
Intel Corporation
Wilfred GOMES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ON ACTIVE SILICON SEMICONDUCTOR PACKAGES
Publication number
20210013188
Publication date
Jan 14, 2021
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS