Mark W. Kapfhammer

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Near tier decoupling capacitors
- Patent number 11,694,992
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct attachment of capacitors to flip chip dies
- Patent number 11,404,365
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment carrier for interconnect bridge assembly
- Patent number 11,393,759
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit
- Patent number 11,031,373
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip carrier for bridge assembly
- Patent number 10,916,507
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Charles L Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,892,249
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,840,214
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,515,929
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,431,563
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively soluble standoffs for chip joining
- Patent number 9,673,177
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of metal thermal interface
- Patent number 8,232,636
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James N Humenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing known good die
- Patent number 7,806,312
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Lannie R Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical micro plugs for multichannel and multilayer pharmaceutical...
- Patent number 7,645,423
- Issue date Jan 12, 2010
- International Business Machines Corporation
- Govindarajan Natarajan
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for removing known good die
- Patent number 7,168,609
- Issue date Jan 30, 2007
- International Business Machines Corporation
- Lannie R Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex die punching apparatus and method
- Patent number 6,272,957
- Issue date Aug 14, 2001
- International Business Machines Corporation
- William Dale Carbaugh
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Formation of punch inspection masks and other devices using a laser
- Patent number 6,207,330
- Issue date Mar 27, 2001
- International Business Machines Corporation
- James Gregory Balz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of visually inspecting positioning of a pattern on a substrate
- Patent number 6,127,069
- Issue date Oct 3, 2000
- International Business Machines Corporation
- James Gregory Balz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Flex die punching apparatus and method
- Patent number 6,116,127
- Issue date Sep 12, 2000
- International Business Machines Corporation
- William Dale Carbaugh
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Flex die punching apparatus and method
- Patent number 5,974,931
- Issue date Nov 2, 1999
- International Business Machines Corporation
- William Dale Carbaugh
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Formation of punch inspection masks and other devices using a laser
- Patent number 5,958,628
- Issue date Sep 28, 1999
- International Business Machines Corporation
- James Gregory Balz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of sorting two-dimensional graphic images for converting int...
- Patent number 5,929,865
- Issue date Jul 27, 1999
- International Business Machines Corporation
- James G. Balz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for machining and depositing metallurgy on ceramic layers
- Patent number 5,522,963
- Issue date Jun 4, 1996
- International Business Machines Corporation
- Robert H. Anders
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
NEAR TIER DECOUPLING CAPACITORS
- Publication number 20220271005
- Publication date Aug 25, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20210175207
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY
- Publication number 20210104464
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Thomas Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES
- Publication number 20200357737
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20200312812
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY
- Publication number 20200176383
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190378816
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312009
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312011
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312010
- Publication date Oct 10, 2019
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING
- Publication number 20170170148
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
- Publication number 20110180923
- Publication date Jul 28, 2011
- International Business Machines Corporation
- JAMES N. HUMENIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE
- Publication number 20070057024
- Publication date Mar 15, 2007
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MICRO PLUGS FOR MULTICHANNEL AND MULTILAYER PHARMACEUTICAL...
- Publication number 20060039831
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Govindarajan Natarajan
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method and apparatus for removing known good die
- Publication number 20040041011
- Publication date Mar 4, 2004
- International Business Machines Corporation
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Mark W. Kapfhammer

Person

Patents Grantslast 30 patents

Near tier decoupling capacitors

Spacer for die-to-die communication in an integrated circuit and me...

Direct attachment of capacitors to flip chip dies

Alignment carrier for interconnect bridge assembly

Direct bonded heterogeneous integration packaging structures

Spacer for die-to-die communication in an integrated circuit

Multiple chip carrier for bridge assembly

Carrier and integrated memory

Carrier and integrated memory

Direct bonded heterogeneous integration packaging structures

Carrier and integrated memory

Carrier and integrated memory

Selectively soluble standoffs for chip joining

Reliability enhancement of metal thermal interface

Method and apparatus for removing known good die

Optical micro plugs for multichannel and multilayer pharmaceutical...

Method and apparatus for removing known good die

Flex die punching apparatus and method

Formation of punch inspection masks and other devices using a laser

Method of visually inspecting positioning of a pattern on a substrate

Flex die punching apparatus and method

Flex die punching apparatus and method

Formation of punch inspection masks and other devices using a laser

Method of sorting two-dimensional graphic images for converting int...

Method for machining and depositing metallurgy on ceramic layers

Patents Applicationslast 30 patents

NEAR TIER DECOUPLING CAPACITORS

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY

DIRECT ATTACHMENT OF CAPACITORS TO FLIP CHIP DIES

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

MULTIPLE CHIP CARRIER FOR BRIDGE ASSEMBLY

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING

RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE

METHOD AND APPARATUS FOR REMOVING KNOWN GOOD DIE

OPTICAL MICRO PLUGS FOR MULTICHANNEL AND MULTILAYER PHARMACEUTICAL...

Method and apparatus for removing known good die